TATA CARA PENGISIAN PADA PEMBUNGKUSAN CHIP KETOK TUANGANThe electrical interconnections between an integrated circuit chip assembly are encapsulated and reinforced with a high viscosity encapsulant material in a single step molding process wherein a mold is placed over an integrated circuit chip assembly...
The unitary refill device is simply set on top of the ink jet cartridge and pushed downwardly towards the cartridge to unseal and refill the cartridge.TIN ZAW AYEWONG CHUNG MUN