Quasi-Three-Dimensional modeling, where a device is represented by several one-dimensional model units and the network which connects them, is extended to the transient analysis of I<SUP>2</SUP>L devices. Even at high current levels good agreement between the computed delay time and the measure...
aMobile end devices (MED) carried by people transmit 正在翻译,请等待... [translate] abut cannot relay messages to other devices.[translate] aThese nodes play the role of reduced function devices, sup-[translate]
waveguide-mode intersubband /spl chi//sub 2nd//sup cn/ devicesphase matchingconversion efficiencywaveguide mode second-Summary form only given. The conversion efficiency for waveguide mode second-harmonic generation (SHG) with detuned intersubband transitions in asymmetric double quantum wells (ADQW) is...
This in-depth video shows the viewer how to reduce EMI (electromagnetic interference) in isoPower® devices.
For LDD devices, the voltage drop in the lightly doped, n/sup -/ region will strongly affect the subthreshold current, and must be modeled accurately. The ... LM Chua,PC Liu - Symposium on Circuits & Systems 被引量: 0发表: 1993年 Low-frequency noise in submicrometer MOSFETs with HfO/su...
The ADuM5020 eliminates the need to design and build an isolated 500mW dc-to-dc converter. The ADuM5020 provides isolated power that is well below CISPR22/EN55022 Class B limits when at full load on a 2-layer printed circuit board. Visit the ADuM5020 Product Page 行业...
Scientific explanation of e and Weyl fermion for injecting semiconductor devices doi:10.3389/felec.2024.1372631Frontiers in ElectronicsAbbas, Arwa Saud
The impact of N<sup>-</sup>drain length and gate—drain/source overlap on submicrometer LDD devices for VLSI 来自 onacademic.com 喜欢 0 阅读量: 11 作者:R Izawa,E Takeda DOI: 10.1109/edl.1987.26701 年份: 1987 收藏 引用 批量引用 报错 分享 全部来源 求助全文 onacademic.com ...
3D Manifolded embedded Micro-Coolers (3DMMC) devices are becoming increasingly attractive and thereby, sought after active cooling solutions for high power density electronic components and devices. 3D-MMCs have shown the potential to effectively cool extreme levels of heat flux, characteristic of high...
SiC Power Devices on QUASIC and SiCOI Smart-Cut Substrates: First Demonstrations Wafer bonding technologies have been recognized to provide new substrates structures suitable for the development of Si power devices. Among the multiple e... F Letertre,N Daval,F Templier,... - 《Materials ...