产品名称：半固化片（SP225GN）PRODUCT USE: Bonding layer for printed circuitry.用途：用于制作印刷电路板用黏合片。NAME of COMPANY and ADDRESS: Shengyi Technology (Suzhou) Co.,Ltd.No.288 Xinglong St. SuZhou Industrial Park, SuZhou City, JiangSu Province, China 公司名称及地址：苏州生益科技有限公司;...