1. The name of the product design: a lead frame (SOT23). 2. 本外观设计产品的用途:用于3脚晶体管封装. 2. The product design purposes: for 3 feet transistor package. 3.本外观设计的设计要点:引线框架为薄板,在框架上有1120个3脚引线架,其中一脚引线上有凹槽. 3. The design features a design:...
1. The name of the product design: a lead frame (SOT23). 2. 本外观设计产品的用途:用于3脚晶体管封装. 2. The product design purposes: for 3 feet transistor package. 3.本外观设计的设计要点:引线框架为薄板,在框架上有1120个3脚引线架,其中一脚引线上有凹槽. 3. The design features a design:...
The utility model discloses a SOT23 lead frame structure, the SOT23 lead frame structure includes frame and a plurality of modes of arranging X Y row with the X installation unit on the frame that arranges, and every N is listed as installation unit and is provided with one promptly and ...
PACKAGE MECHANICAL INFORMATION SOT23-5 Package Outline Dimensions This surface mount package consists of a chip mounted on a leadframe and fully encapsulated in an epoxy mold compound. With Pb-Free terminations, this package meets the requirements of IPC/Jedec J-STD-20, moisture level 1 at 260 ...
Amkor’s SOT23 and TSOT are leadframe based, plastic encapsulated packages that are designed for applications requiring very small footprints.
This is a molded JEDEC SOT-23 package with lead free 100 % Sn plating on the lead frame. It weighs approximately 0.6 g and has a flammability rating of UL 94V-0. A B A B C 3 J C D 1 2 I E E D F MILLIMETERS (INCHES) DIMENSIONS = MILLIMETERS (INCHES) DIMENSIONS ...
文件页数/大小:4 页 / 298 K 品牌: BOURNS [ BOURNS ELECTRONIC SOLUTIONS ] CDSOT23-T03~T36C – TVS Diode Array Series Product Dimensions Recommended Footprint This is a molded JEDEC SOT-23 package with lead free 100 % Sn plating on the lead frame. It weighs approximately 0.6 g and has a...
制造商 : PHYTON 产品分类 : 其它元件 Datasheet: AE-SOT23-24XX Datasheet (PDF) RoHs Status: Lead free / RoHS Compliant 库存: 520 Share: Pinterest LinkedIn WhatsApp Facebook Line X 分享 对比产品 数量 加入BOM 询价 在线询价 温馨提示: 请填写以下信息,以便客户代表及时与您沟通库存数量和...
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above...
AO34XX ICP Report Summary for SOT23 TYPE2 NO.RawMaterial Maker&SPEC 1Chip HHNEC(Silicon)Henkel2Dieattachmaterial (84-1LMISR4)3LeadFrame ASM(AgPlating)PbN.D.Br:ND CdN.D.Cl:ND Content Hg Cr6+ PBBPBDE The3rd data partyTestDate LAB N.D.N.D.N.D.N.D.C:\Documents andSettings\ya HBC...