SOP：Standard Operating Procedure 标准操作程序，作业指导书 设备部门：Equipment Department Facility Department Maintenance Department 上面任选
SAP，全称是subject affirmatvie predicate，全称肯定命题，A是affirmatvie，拉丁语里是a-fir-mo，取第一个元音，A。全称肯定命题反映了主项的所有外延全都具有某种性质，表示形式为：所有S是P，SEP，全称是subject negative predicate，全称否定命题，E是negative，拉丁语里是ne-go，取第一个元音，E。...
Heatsink Small Out-Line Package (带散热片的小尺寸封装)HSOP is a surface mount package with ìgull wingî lead form.This package has a mechanically attached thick Copper (Cu) heat slug to improve the thermal performance.The exposed heat slug provides a direct path for heat conduction awayfro...
英文全称 Iliamna, Alaska USA 中文解释 美国阿拉斯加州伊利亚姆纳 缩写分类 REGIONAL 应用领域 Airport Codes 流行程度 4538° 简要解释 无 以上表格展示了“ILI”的主要定义,其中中文解释由机器翻译(标记“人工审核”除外) “ILI”其他含义 缩略词英文全称 / 中文翻译 ...
HSOP是什么封装,英文全称是什么,谢谢 扫码下载作业帮搜索答疑一搜即得 答案解析 查看更多优质解析 解答一 举报 Heatsink Small Out-Line Package (带散热片的小尺寸封装)HSOP is a surface mount package with ìgull wingî lead form.This package has a mechanically attached thick Copper (Cu) heat slug ...
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HSOP is a surface mount package with ìgull wingî lead form. This package has a mechanically attached thick Copper (Cu) heat slug to improve the thermal performance. The exposed heat slug provides a direct path for heat conduction awayfrom an IC and into a solder attached ...