The Sony IMX816 is a 50 MP 1/2.93” format Exmor RS stacked back-illuminated (BI) CMOS image sensor (CIS) with a pixel pitch of 0.60 μm. The IMX816 was on the TechInsights’ roadmap as the first 0.60 μm pixel from Sony. This report provides an extended insight into the ...
with wafer-level hybrid bonding to help manufacture its new SWIR imagers. In Die-to-Wafer Hybridization, a handle wafer supports an array of pre-manufactured SWIR InGaAs Die so that hybrid bonding can take place much like conventional CMOS Image Sensors CIS-to-ISP wafer-level bonding. ...
OMNIVISION is a leading Semiconductor Manufacturer of Sensing, Analog and Touch & Display Solutions. We offer imaging solutions for the Automotive, Medical Imagining, Mobile Devices, Surveillance and Drone and laptop computer industries.
The Sony IMX816 is a 50 MP 1/2.93” format Exmor RS stacked back-illuminated (BI) CMOS image sensor (CIS) with a pixel pitch of 0.60 μm. The IMX816 was on the TechInsights’ roadmap as the first 0.60 μm pixel from Sony. This report provides an extended insight into the ...
The Sony IMX816 is a 50 MP 1/2.93” format Exmor RS stacked back-illuminated (BI) CMOS image sensor (CIS) with a pixel pitch of 0.60 μm. The IMX816 was on the TechInsights’ roadmap as the first 0.60 μm pixel from Sony. This report provides an extended insight into the ...