Due to this elastically deformable material, the suction pipette (S) can then be used for pressing the components (BE) onto the soldering point even if the components (BE) are in a sloping position on the printed circuit board (LP). Loading of the connecting legs (A) of the oblique ...
In this process solder paste is printed on the track of the circuit board where the component is to be soldered. Printing of the solder paste can be done using a solder paste dispenser or through stencil printer. This board with solder paste and components of the paste is then passed throu...
When it comes toPrinted Circuit Board (PCB) designand fabrication, soldering is of great importance. This is because, soldering is the process through which all components are placed on to board and if it is not of high quality, then PCB performance is also compromised. Soldering can be cons...
Soldering of Components on Printed-Circuit Boards In the early 1950s, the printed circuit board concept spread rapidly throughout the industrial world. This chapter provides various characteristics and fea... rpart 被引量: 0发表: 0年 CONNECTOR AND CONNECTING STRUCTURE BETWEEN PRINTED CIRCUIT BOARDS...
The circuit board (1) is provided with a number of shallow recesses (e.g. 2) each matched to the external contour of the component to be placed in it. These ensure that the components are held in the desired positions after the solder paste has been applied and before the soldering oper...
These are components you weld onto the PCB board. So, each of these components are useful. You cannot begin soldering without having the amalgam and pieces to fasten together to the circuit board. The right supplies definitely make it easier to work. If one of these supplies gets missing, ...
after the small parts are done. This keeps the board relatively flat, making it more stable during soldering. It is also best to save sensitive components (MOSFETs, non-socketed ICs) until the end to lessen the chance of damaging them during assembly of the rest of the circuit.Bend the ...
Printed circuit board with solderable of thin metal layer for soldering electronic components 来自 掌桥科研 喜欢 0 阅读量: 8 申请(专利)号: DE19934301728 申请日期: 1993-01-22 公开/公告号: DE4301728C2 公开/公告日期: 1997-12-11 申请(专利权)人: HITACHI, LTD., TOKIO/TOKYO, JP 发明人:...
一种感应回流焊装置及使用该装置的电路板元器件焊接方法 An induction reflow soldering apparatus using the device and circuit board components welding method 本发明提供了一种感应回流焊装置及使用该装置的电路板元器件焊接方法的技术方案,该方案包括有主机,电感线圈阵列和传输带;电感线圈阵列由多个内置螺线管线圈的...
necessary for providing the electrical contact with the printed circuit board and the electrical component are linked by a support structure (11) made as a single piece, c) the invention relates to soldering supports intended to receive electrical components especially for a printed circuit board. ...