The work proposes a number of methods to enhance the defects inspection performance of solder paste printing: a regional multidirectional data fusion image interpolation method, which can achieve fast and high precision image interpolation; a method for detecting solder paste areas wit...
VP5200-V Solder Paste Inspection Machine说明书 Taking SPI speed and accuracy to the next level Solder Paste Inspection Machine VP5200-V
Loss of solder paste activity can lead to the appearance of solder beads, cold soldering, dummy soldering, short circuits and other defects. Factors that reduce the activity of solder paste Solder paste activity is generally reduced due to two factors: heat and flux loss. Heat means that the ...
Increasing production processes due to solder paste defects on PCBs, which can generally be detected at the final stage of the mass production process, cause the test processes of especially strategic projects to be disrupted. In this study, a deep learning model whose model parameters are ...
Form No. 98523 (A4) R17 PRODUCT DATA SHEET Indium8.9HF1 Pb-Free Solder Paste Printing Stencil Design: Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The ...
You will see Ed Briggs and Ron Lasky of Indium use the exact same description in their white paper on defects, causes and solutions: http://www.circuitinsight.com/pdf/best_practices_reflow_profiling.pdf Suggest printing out the profile and submitting it to your solder paste manufacturer for re...
it's function is to point the operator's attention to suspected areas on the PCB that might have defects. Different machines have different inspection capabilities and parameters you need to configure in order to screen for possible defect areas while maintaining a minimum of false alarms. If you...
Download PDF 20220007518 Primary Examiner: SAAD, ERIN BARRY Attorney, Agent or Firm: LOON LLC (New Providence, NEW JERSEY, US) Claims: 1.A method of fabricating a printed circuit board, the method comprising:printing solder paste onto a plurality of contact areas of the printed circuit board;...
A solder paste dispensing assembly provides for the controlled application of a predetermined solder paste pattern to a surface. The surface can be on a printed circuit board, prior to or after the bo
Indium5.8LS Pb-Free Solder Paste Packaging Standard packaging for stencil printing applications includes 4 oz. jars and 6 oz.or 12 oz. cartridges. Packaging is also readily available. For dispensing applications, 10cc and 30cc syringes are standard. Other packaging options may be available upon ...