Tell me who in China makes solder for Kester, and I will buy from that Chinese factory, not from Kester. Tell me who makes solder for other Western brands. Until you tell me that, "While anything from China is a gamble" is spot on and it is Your statement which is silly.BTW if yo...
Spectrum Analysers: Tiny SA Ultra https://soldersmoke.blogspot.com/2023/09/the-tinysa-ultra-spectrum-analyser-video.html and Polarad 632C-1; George WB5OYP gave me one of these spectrum analysers (I NEED a manual! Does anyone have a manual or a schematic? ) : Polarad 632C-1 Stabili...
the sets that we have used were made (badly, in China) of low-grade cast metal and cost about $2 each. Not to say thatcertainof these don’t have their appeal, but it still strikes me as wrong in a couple of different ways. ...
Bringing a project to life? Send me a message!
in which the solder resist surface of the mounting substrate is heavily populated with solder ball contact pads and/or and solder balls, and/or in applications where the chip outline is nearly the same size as the package (e.g., Chip Scale Packages (CSP), Near Chip Size (NCS), etc.)...
Now take the soldering iron and place it near the end that is sticking out and apply some solder, apply a generous amount until a small mound forms on the top. Did I already tell that the solder on the wires melt and attach to the sides of the holes?
(Received November 12, 2015; accepted April 25, 2016; published online May 13, 2016) great many number of studies have been targeted on the synthesis of nanoparticles of pure Sn,6 as well as near-eutectic SA1,2 and SAC alloys1,7,8 as promising candidates for the next generation of Pb...
I found out about theInteractive Telecommunications Programat NYU — where people work with electronics and computer vision and such. The first time I walked in there, I still thought I was going to make movies, but then it felt as if the mothership was calling out to me. That was my fi...
in which the solder resist surface of the mounting substrate is heavily populated with solder ball contact pads and/or and solder balls, and/or in applications where the chip outline is nearly the same size as the package (e.g., Chip Scale Packages (CSP), Near Chip Size (NCS), etc.)...
This paper discusses the effects of the most important variables during isothermal fatigue such as strain range, ramp time, tensile and compressive hold times, and temperature on fatigue life of near–eutectic 62Sn–36Pb–2Ag solder at strain ranges below 3.0%. The Coffin-Manson relation does ...