Ideal for BGA repair, Arduino, and STM electronic projects Features: |Solder For Metal|Flux Core Wire Welding Stainless Steel|Flux Used In Soldering| **Efficient Solder Removal and Cleaning** The 1.5M Desoldering Braid Welding Solder Remover is a versatile tool designed for a wide range of elec...
网络焊剂;焊接剂;软焊 第三人称单数:solders现在分词:soldering过去式:soldered 同义词 v. join,fuse,weld,bond,connect 权威英汉双解 英汉 英英 网络释义 solder n. 1. [u] 焊料;焊锡a mixture of metals that is heated and melted and then used to join metals, wires, etc. together ...
The invention provides a hard solder alloy for bonding oxide ceramics to each other or to metal, particularly to alloy steels. The hard solder alloy comprises 65-80% copper, 15-35% titanium, 0.5-5% aluminum and 0.5- 5% vanadium. The invention also provides a method of bonding the surfaces...
20. Undertake to so thin rustily conduit solder fills, still do not have precedent. 对如此薄的锈蚀管道进行焊补,尚无先例。 solder 词典解释 1.焊;焊接;焊合 If you solder two pieces of metal together, you join them by melting a small piece of soft metal and putting it between them so th...
During soldering, the flux removes metal oxides as well as other surface tarnishes, such as grease or metal carbonates, hence allowing the coalescence of solder ... NC Lee - 《Reflow Soldering Processes》 被引量: 0发表: 2001年 Soldering flux for the base resin, soldering flux and solder ...
Used with thesolderwire together,solderinga stainless steel etc metal. 同锡线一起使用, 焊接不锈钢等难以上锡的金属. 期刊摘选 Interface void damage is the failure characteristic ofsolderjoint under temperature cycling. 温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度. ...
Metallic Resources is comprised of “hands-on” industry experts who understand the metallurgy of solder and mechanics of soldering.
The invention relates to a silver solder paste and to a silver solder paste containing copper, which can be used to join metal or metalized substrates, in particular copper substrates, without pressure at low temperatures. The silver solder according to the invention contains a metal-organic ...
PROBLEM TO BE SOLVED: To obtain a die attach paste for semiconductor which has excellent adhesiveness, low stress property and solder crack resistance, and... T Toshiro,A Katsutoshi 被引量: 0发表: 1999年 Die attach by temperature gradient lead free soft solder metal sheet or film A die atta...
Application:IC;Product name:DC Glass-to-metal Hermetic Seal;Shell and Pin Material:Kovar 4J29;Color:Gold;Withstand Voltage:≥300V;Insulation Resistance:≥1000MΩ;Operating temperature:-65℃~+260℃;Keywords:Hermetic Seal;Leak Rate:1.01325 X 10-3 Pa*cm3/s;