Cadence PCB 建库说明 硬件工程师 一、PCB 封装属性: ①图形--焊盘pad 、阻焊层/ 阻焊盘soldermask、助焊层/助焊盘pastemask ; ②标示--元件标示RefDes 、元件值value 、器件值Device ; ③边框--器件机械边框assembly_Top、布局 区域Place_Bound_Top 、丝印边框silkscreen_Top; 、布局 区域 规范说明: ①图形...
以前我都是设为一样,但是后来发现allegro做pad库设置regular pad的时候,soldermask层要比其他层大4mil,这是为什么呢 这个简单,阻焊本来就应该比焊盘大阿,如果你做的一样大的话,PCB板厂会把你的阻焊放大的。 防止绿油覆盖焊盘 无铅制程时,还是一样大的好的。 原来这样啊 为什么无铅制程时一样大会比较好? IPC标...
Solder mask: 阻焊层,也称绿油层,一般设置比焊盘稍大0.1mm. Paste mask: 助焊层,也称钢网层,表贴元件需要设置,一般同焊盘大小; 如果需要某根走线,铜皮或者焊盘开窗不盖绿油并喷上锡或者沉金,必须另外再添加solder层, 在solder层对应着需要漏铜的线路层开窗,paste只是钢网层(PCB底板厂此层不进行处理), 用于制作...
While some materials are more challenging, and can result in buttercoat attack or delamination, you can rest assured that you have the best opportunity for success when your solder mask stripping is done by the industry leader with 25 years of experience. MaskTek: Precision Pad Technology | ...
Solder Mask Layers: 即阻焊层,就是PCB板上焊盘(表面贴焊盘、插件焊盘、过孔)外一层涂了绿油的地方,它是为了防止在PCB过锡炉(波峰焊)的时候,不该上锡的地方上锡,所以称为阻焊层(绿油层),我想只要见过PCB板的都应该会看到这层绿油的,阻焊层又可以分为Top Layers R和Bottom Layers两层,Solder层是要把PAD露出...
Solder mask defined pads (SMD) are formed by coating solder pads on some copper foils, while unshielded copper foils form solder pads. The opening of the solder mask is smaller than that of the copper solder pad.
A method for applying the solder mask onto solder pad spacings of a printed circuit board, mainly referring to the use of an ink-jet printer for printing the solder mask at the dense solder pad area on a printed circuit board, so as to prevent the solder mask from being coated onto ...
Solder mask defined pads If there is a need to define solder pads in ground planes, we ask you to consider the effects of the thermal conductivity of copper surfaces on your soldering process. For solder mask defined pads, it can be necessary to reduce the connection of the pad to the re...
另一种焊垫的设计是将[solder mask](绿漆/绿油)覆盖于铜箔上并露出没有被mask的铜箔来形成焊垫(pad),这种焊垫设计称为【Solder-mask Defined Pad Design,SMD】。这种焊垫设计可以有效加强焊垫的强度(strength),并且强化落下测试(drop test)时的承受能力。依据实验测试结果,这种【Solder-mask Defined Pad Design...
Mask Technology Inc. was formed in 1983 as the first value added service bureau in the United States dedicated to the application of Solder Masks on Printed Circuit Boards. The company's core focus ...