METAL MASK FOR PRINTING SOLDERPROBLEM TO BE SOLVED: To provide a metal mask for printing solder, which can secure a mounting rigidity and, at the same time, can suppress the occurrence of solder balls.NAGAYAMA YOSHIFUMI永山 宜史MORIOKA NOBORU森岡 登MATSUZAKI TETSUJI...
网络油墨 网络释义 1. 油墨 ...eveloper) 去光阻液(Stripper)油墨(Solder mask, ink) 可剥胶(Peelable mask) 印刷网板(Stencil) 金属光罩(Metal mask) www.bizman.com.tw|基于244个网页 例句
PURPOSE: metal mask printing solder and its manufacturing method provide the metal mask prolonged its service life with Diamond-Like-Carbon by film forming amorphous carbon-film. ;CONSTITUTION: metal mask printing solder includes metal plate (100) and amorphous carbon (130). The metal plate includes...
PROBLEM TO BE SOLVED: To provide a metal mask for printing a cream solder capable of improving reliability of printability and solderability with a simple constitution without thinning a screen in thickness.;SOLUTION: Ends S1, S2 of an opening 12a of the metal mask 12 in a longitudinal directio...
The solder mask is the green part of the printed circuit board(PCB) we often see. It is also called a solder resist or solder-top mask, which is a thin layer of polymer lacquer to protect copper traces from oxidation and prevent short circuits. In fact, besides the green cover, there ...
Solder masks protects metal elements on a PCB from oxidation and electrical "bridging" between solder pads. Learn about the best solder stop mask PCB approach for your project.
PROBLEM TO BE SOLVED: To provide a metal mask for solder printing, along with its printing method, capable of preventing solder shorting failure caused by sagging, by suppressing solder from sagging on the recess of a substrate during a process for removing a metal mask, in solder printing wit...
PURPOSE: To provide a metal mask for printing cream solder and a method for attaching the mask to a frame. ;CONSTITUTION: Holding parts 3 extended integrally from opposed sides of a metal mask 1 are provided, and many holes are laterally provided at the parts 3 to form tensile force buffer...
by forming bump forming holes having slant surfaces toward an evaporating source. CONSTITUTION:Pad electrodes 5, on which, e.g., a chromium film is deposited, are formed at bump forming parts of a film substrate 1 to be formed by sputtering method beforehand. For a metal mask 3, a mask ...