1.1. The solder joints in various plated-through hole (PTH) and surface mount technology (SMT) printed circuit board (PCB) assemblies, and semiconductor packages will be discussed in this chapter.doi:10.1007/978-981-15-3920-6_1John H. Lau...
PCBA processing solder joints are invalid because of poor electronic component pins, flux quality defects, unqualified residues, and air oxidation; in addition, the quality control method is to submit a manufacturability report (DFM) according to different customer needs. Next, I will introduce the ...
A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue behavior of the solder joints in Chip Scale Packages (CSP) mounted on Printed Circuit Boards (PCB). The time-dependent and time-independent viscoplastic strain rate and pla...
1)solder joints焊锡接点 1.The results show that bolt constraints have a significant influence on the dynamic stress in solder joints.建立了板级BGA封装跌落/冲击问题的三维有限元模型,采用Input-G方法对PCB板的变形及焊锡接点应力等动力学响应进行了分析,探讨了约束条件对计算结果的影响,对焊点剥离应力产生的...
See also: SMT soldering techniques for PCB assembly Ensuring the solder joints are made correctly is of prime importance in any electronics construction. Solder joints that are poor will either cause the equipment to not to work once it has been completed, or there is the possibility that the ...
Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish In this paper, the effect of gold amount on the gold embrittlement of solder balls in wafer-level chip-scale package (WLCSP) CSP 80 is investigated. First,... X Huang,...
Who might be involved Designers of enclosures Electrical designers Designers of PCB layout Eventually new SW control systems/method Reliability department It is well known that the degradation of solder joints mainly depend of different thermal expand coefficients in the ...
Dry solder joints should be addressed to prevent further issues in PCBs. Some preventive measures for dry solder joints include: Keep surfaces clean: Ensure that component leads and PCB pads are free of dirt, grease, and oxidation. If needed, clean them using an appropriate cleaning agent like...
Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling. Journal of Alloys and Compounds 454 (1e2), 174e179.Xia Y H,Xie X M.Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling. Journal of Alloys and Compounds...
The average strain energy density was also calculated to predict the lifetime of solder joints in these different material and geometrical conditions through this modified Darveaux model. The experiment and simulation reveal that the solder joints in the corners of the package suffer much higher ...