必应词典为您提供Solder-Joint-Strength的释义,网络释义: 焊点强度;关于焊点的强度;
Methods of fabricating leadless packages are described that provide good solder joint reliability. In most respects, the packages are fabricated in a manner similar to current lead frame based leadless packaging techniques. However, at some point in the process, the contacts are provided with under...
This growth does not impair the solder joint strength of ENIG, ENEPIG or DIG under the conditions of SAC alloy soldering.As shown in Figure 5, eutectic Sn/Pb SEM examination explained why the ENEPIG failed prematurely with aging. There was irregular areas of excessive IMC growth. This is ...
Enhanced solder joint strength and ease of inspect 优质文献 相似文献 参考文献 引证文献Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints Accelerated reliability tests have been performed on leadless and leaded lead-free and lead containing SMT comp...
Some of the elements have a negative effect and inhibit joint formation. The additions that enhance the strength of solder joints mainly serve to reduce the thickness of intermetallic phases that form at interfaces and can be a source of mechanical weakness [23]. 1.2 Lead-free solders In ...
A clear joint volume effect on the strength has been found, i.e., the joint's strength increases with decreasing joint volume ( V = fracp4d2 t ), left( {V = {frac{pi }{4}}d^{2} t} right), and the correlation follows an inverse proportional function reasonably well....
However, the solder joint strength tends to be weak when EL Ni/Au plating is applied to the PWB pads, especially BGA/CSP pads. The fracture mode of intermetallic layers between solder and nickel is observed on weakened pads. We have been analyzing the factors of this problem, and were ...
solder joint 美 英 un.锡焊接头;软钎焊 网络焊点;焊点中;焊接连接 英汉 网络释义 un. 1. 锡焊接头 2. 软钎焊 例句 释义: 全部,锡焊接头,软钎焊,焊点,焊点中,焊接连接
A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of ni...
For package level reliability test, ball shear test is performed to evaluate the joint strength of fresh and reworked solder balls. The results show that solder balls with rework process exhibit higher shear strength than the ones without any rework process. The results also exhibit that the ...