Multidiscipline Modeling in Materials and Structures 2: 309-326.C. Basaran, J. Gomez, M. Lin, and S. Li, "Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging," Multidiscipl. Model. Mater. Struct., vol. 2, no. 3, pp. 309-326, Jan. 2006....
Luo, S.M.Wang, K.Q.Li, G.Y.Elsevier B.V.Journal of Alloys & CompoundsY. Tang, S.M. Luo, K.Q. Wang, G.Y. Li, Effect of nano-TiO2 particles on growth of in- terfacial Cu6Sn5 and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2 solder joints, J. Alloys Compd. (2016)....
Luo, K.Q. Wang, G.Y. Li, Effect of nano-TiO2 particles on growth of in- terfacial Cu6Sn5 and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2 solder joints, J. Alloys Compd. (2016).Y. Tang, S.M. Luo, K.Q. Wang, G.Y. Li, Effect of nano-TiO2 particles on growth of in- ter...