vs Qualcomm Snapdragon 8s Gen 3 vs Mediatek Helio G99 vs Qualcomm Snapdragon 685 4G vs Qualcomm Snapdragon 6 Gen 3 vs Samsung Exynos 1380 vs MediaTek Dimensity 7300 vs Qualcomm Snapdragon 7s Gen 2 vs MediaTek D
vs MediaTek Dimensity 8300 vs Unisoc T606 vs MediaTek Helio P35 vs Qualcomm Snapdragon 6 Gen 1 vs Qualcomm Snapdragon 695 5G vs Unisoc T606 vs MediaTek Helio G85 vs Qualcomm Snapdragon 6 Gen 1 vs MediaTek Dimensity 7300 vs Unisoc T606 ...
MediaTek Dimensity 900 vs Qualcomm Snapdragon 8 Gen 1 vs MediaTek Dimensity 7300 - Benchmarks, Tests and Comparisons
相比之下，Snapdragon 8 Gen 3的功耗为5.8W，而Dimensity 9300的功耗为5.4W，Dimensity 9400的功耗优势达到了18.5%至24%。散热性能：Dimensity 9400保持冷静 在散热方面，Dimensity 9400同样表现出色。在同样的游戏测试中，Dimensity 9400的温度仅为43.2°C，远低于Snapdragon 8 Gen 3和Dimensity 9300+设备的...
Dimensity 9200++ 95 Points(26%) 174% SD 8 Gen 2 for Galaxy+ min: 145 avg: 165.5 median:165 (45%)max: 187 Points WebXPRT 3- WebXPRT 3 Score 100% Dimensity 9200++ 143 Points(26%) 162% SD 8 Gen 2 for Galaxy+ min: 183 avg: 219 median:231 (41%)max: 243 Points ...
Dimensity 9400 vs Snapdragon 8 Gen 3: Key Differences TSMC has manufactured both the Dimensity 9400 and Snapdragon 8 Gen 3, although the process nodes are different. The former is fabricated using a 3nm node, offering better performance and power efficiency than the 4nm node used for the lat...
Snapdragon 7 Gen 3 vs Dimensity 7200: Benchmarks Geekbench 6 score: Geekbench evaluates a device’s performance through a series of tests designed around practical scenarios. The tests include image processing, compression (text & image), speech recognition, and PDF rendering, to name a few. ...
处理器性能：Dimensity9000Plus作为联发科的高端处理器，具有出色的性能和能效比。它与Snapdragon8+Gen1在高端市场上形成竞争，两者的性能表现都相当强劲。因此，从处理器层面来看，ROGPhone6D具备与搭载Snapdragon8+Gen1的设备相抗衡的实力。游戏优化与体验：ROGPhone系列一直以游戏性能著称，ROGPhone6D继承了6...
Redmi K60 – Up to 3.2GHz Octa Core Snapdragon 8+ Gen 1 4nm Mobile Platform with Adreno next-gen GPU Redmi K60E – Up to 3.1GHz Octa Core MediaTek Dimensity 8200 4nm processor with Mali-G610 MC6 GPU K60 Pro – 8GB / 12GB / 16GB LPPDDR5x 8533Mbps RAM with 128GB (UFS 3.1...
无论如何，看到一款甚至不是联发科今年最好的芯片击败高通的两款旗舰处理器，仍然是非常了不起的。联发科2022年的旗舰方案其实是天玑9000芯片，而天玑8000系列只针对中高端智能手机。最重要的是，与骁龙 8 Gen 1 采用的尖端 4nm 工艺相比，Dimensity 8000 芯片使用了较旧的 5nm 工艺。但高通确实有另一张牌。该...