4. 贴片元件（Surface Mount Device，SMD）：体积小、适合表面安装的电子元件，例如电阻、电容、二极管等。5. 焊接炉（Reflow Oven）：加热设备，用于在预定温度下加热整个PCB，使焊膏熔化并实现焊接。6. 贴片机（Pick and Place Machine）：自动化设备，用于快速、准确地选择和放置SMD元件。7. AOI检测（Automated O...
覆盖在PCB表面的油墨,用于遮盖不需要焊接的区域,防止短路和腐蚀。 13. Reflow Profile(回流焊曲线): 描述了在焊接过程中加热速度、温度峰值和冷却速度等参数,对焊接质量至关重要。 14. SMT贴片机械手(Pick and Place Robot): 负责抓取和放置元器件的机械手部分,影响生产速度和准确性。 15. SMT贴片工艺流程(SMT ...
Company Profile Shenzhen Jaguar Automation Equipment Co., Ltd. is a professional Reflow Oven and Wave Soldering Manufacturer in Shenzhen, China. We focus on SMT and THT Soldering technology for more than 10 years, and our engineers have more than 20 years experience.We are certified National...
Company Profile Shenzhen Jaguar Automation Equipment Co., Ltd. is a professional Reflow Oven and Wave Soldering Manufacturer in Shenzhen, China. We focus on SMT and THT Soldering technology for more than 10 years, and our engineers have more than 20 years experience.We are certified Nati...
All MK7 modules offer larger impeller motors giving higher dynamic pressure and lower delta T’s on board. The module’s low height profile and optimized air path contributes to more uniform heating. Regardless of board size or oven loading condition, the MK7 solder reflow ovens provide best in...
使用與 SMT PROFILE 之測試. 3. 权责:制造部所有回流焊均之。 4. 名词解释:无 5. 相关文件 5-1.KIC 的使用 5-2.錫膏承認書 6.內容: 6-1. Reflow 溫度量測 : a. 操作使用工具: 棉質手套口罩,量測儀器. b. 程序的開啟:點擊桌面圖標啟動 KIC 2000 軟體。進入下面畫 面﹕. . v...
8. 回焊 (Reflow) 回焊(reflow)的目的是将锡膏熔融并形成非金属共化物(IMC)于零件脚与电路板之间,也就是将电子零件焊接于电路板之上,其温度的上升与下降的曲线(temperature profile)往往影响到整个电路板的焊接品质,根据焊锡的特性,一般的回焊炉会设定预热区(pre-heat)、浸润区(soak)、回焊区(reflow)、冷却区...
Reflow oven for lead-free soldering Easy process programming and parameter setting The LPKF Edition SMT ProtoFlow S4 is an extremely user-friendly convection oven suitable for lead-free SMD soldering of PCBs up to a size of 320 x 220 mm. ...
【SMT资料】profile 对reflow制程的影响 Profilecurve ppt课件 1 183oC175oC Reflow Heating Preheating Soaking Cooling Heating:SolventevaporationPreheating:FluxreducesandMetaloxidesSoaking:Solderballsmelt,wettingandwickingbegin.Reflow:Soldermeltingcompletes,surfacetensiontakesover.Cooling:Cooldownphase.ppt课件 2 Heating...
6. High-precision profile process to complete the mesh chain wheel, with a unique support structure can effectively reduce the vibration of the PCB board in the reflow area, easily cope with the welding of small devices of the 0201 class and BGA class complex chips.7...