Signal and Power Integrity - Simplified 作者:Eric Bogatin 出版社:Prentice Hall 出版年:2018-1-2 页数:992 定价:GBP 92.99 装帧:Hardcover ISBN:9780134513416 豆瓣评分 评价人数不足 评价: 写笔记 写书评 加入购书单 分享到 推荐 + 加入购书单
Signal integrity (SI) and power integrity (PI). In this blog post, I’ll take a closer look at the needs of high-speed designs, the role of SI and PI, and three key requirements for an effective SI and PI solution. Why Is It Getting Harder to Meet Signal Integrity and Power ...
Consequently, signal integrity and power integrity issues tend to be the main causes of device failure in various design stages of the product. It is prudent for the design engineer to give careful consideration to the analog characteristics of a high speed PCB design in addition to...
System level signal integrity and power integrity problems for high speed serial links have been explored in this paper. An example of the USB 2.0 IP has b... JN Tripathi,RK Nagpal,R Malik - 《International Journal of Design Analysis & Tools for Integrated Circuits & Systems》 被引量: 2发...
外文名称:Signal and Power Integrity:Simplified(Second Edition) 开本:16开 出版时间:2015-01-01 用纸:胶版纸 页数:418# 图书描述 内容简介 《国外电子与通信教材系列:信号完整性与电源完整性分析(第2版)》全面论述了信号完整性与电源完整性问题。主要讲述信号完整性分析及物理设计概论,6类信号完整性问题的实质含...
This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root cau... ...
Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth ... Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for ...
A method of testing signal integrity and power integrity in an address bus includes determining a worst case switching scenario for victim bits versus aggr... NK Chhabra,G Mathur,A Dalimkar 被引量: 0发表: 2019年 Signal and Power Integrity - Simplified Signal and power integrity, simplified, ...
In this paper, the analysis of the signal integrity and the power integrity (PI) performance of different types of electromagnetic bandgap structures (EBGs) in presence of differential (DIFF) striplines is proposed. Four different configurations of 2-D embedded EBG layers are analyzed. A test ve...
The Signal Integrity and Power Integrity Support Center providesinformation on how to ensure signal integrity and power integrity in your high-speed designs. Get support resources for Intel Stratix® 10, Intel Arria® 10, and Intel Cyclone® 10 devices from the pages below. For other devices...