Cleaning:In this process, the soldering residues that are harmful to the human body on the assembled PCB, such as the flux, are removed. It requires a cleaning machine and its location can vary, whether within or out of the production line. Solder paste inspection (SPI):In this process, ...
BGA assembly is totally compatible with soldering assembly technology. Pitch of chip-scale BGA can be 0.5mm, 0.65mm or 0.8mm and plastic or ceramic BGA components feature wider pitch like 1.5mm, 1.27mm and 1mm. B