semiconductor chip, It comprises a dividing groove forming step for forming a semiconductor wafer from the front dividing grooves having a predetermined depth along the channel; protective element attaching step, the front of the semiconductor wafer dividing grooves for attaching the protective element ...
Implement chip aging test. Carry out chip aging tests according to the test plan. And monitor various parameters and performance indicators during the test process. Analyze chip aging test results. Analyze and process the test data to evaluate the life and reliability of the chip. Feedback and ...
What is a Chip? A chip, an integrated circuit that performs specific functions. These chips are crafted from semiconductor materials, predominantly silicon. They act as the brain of devices, executing tasks ranging from simple calculations to complex operations. Making a computer chip starts with a...
frequencyofunexpectedmaintenanceovertime.Inpractice,doingsoisdifficultbecausethestepsinawaferflow(thepathawafertakesinthechip- makingprocess)areinterdependentandcomplex-asistheequipment.Asaresult,weveobservedthatmanagersfocusonfirefightingin40to70percentoftheinstancesinwhichatoolgoesdown.This approachnecessarilydrivesthe...
‘recipe’ to an output etch result on the virtual wafer (Methods). To the participant, this simulator serves as an effective black-box9conversion of a recipe (for example, pressure, powers and temperature) to the requirements of a process step needed to manufacture a semiconductor chip. ...
Process for fabricating a high performance logic and embedded dram devices on a single semiconductor chip A process for creating a region of high performance logic devices, and a region of low cost memory devices, on a single semiconductor chip, has been developed. The process features CMOS logic...
Design houses play a critical role across the entire chip-making process, from intellectual-property (IP) development to design and production. Additionally, owning an IP pool can help customers meet their design needs quickly and allow them to avoid redundant designs and resources. Design...
Since the method of making a chip package in accordance with the present invention utilizes a low cost film carrier to support the chip during the assembly process and the film carrier can be directly removed to expose the bottom of the chip and the connection pads, the method is simple, ...
As a result, our lithography machines are now a hybrid of high-tech hardware and advanced software. Our development teams work across a range of coding practices, providing innovative solutions to the intricate problems that affect the chip-making systems at the heart of the electronics industry....
United States Patent US5186381 Note: If you have problems viewing the PDF, please make sure you have the latest version ofAdobe Acrobat. Back to full text