US6497802 * Jul 30, 2001 Dec 24, 2002 Applied Materials, Inc. Self ionized plasma sputteringUS6497802 Jul 30, 2001 Dec 24, 2002 Applied Materials, Inc. Self ionized plasma sputteringUS6497802 2001年7月30日 2002年12月24日 Applied Materials, Inc. Self ionized plasma sputtering...
Self-ionized and capacitively-coupled plasma for sputtering and resputtering 发明人: GOPALRAJA PRABURAM;FU JIANMING;TANG XIANMIN;FORSTER JOHN C.;KELKAR UMESH 申请人: 申请日期: 2003-07-31 申请公布日期: 2009-03-17 代理机构: 代理人: 地址: 摘要: A DC magnetron sputter reactor for sputteri...
The volume of the de-ionized water drop used for the measurements was 3 µL. The droplet was put in contact of the surface with a 10 µl syringe and the angle between the tangent of the droplet and the surface was measured after 2 seconds. The optical properties of the ...
Before sputtering, the samples were cleaned with oxygen plasma to remove possible carbon contamination from air. Data availability The data that support the findings of this study are available from the authors on reasonable request, see author contributions for specific data sets....
ITO-coated glass was used as the substrate. Before device fabrication, the substrates were thoroughly cleaned by sequentially sonication with acetone, isopropanol, detergent, de-ionized water, isopropanol, and subsequently dried in a baking oven over night. After that, the substrates were treated by...
A magnetron especially advantageous for low-pressure plasma sputtering or sustained self-sputtering having reduced area but full target coverage. The magnetron includes an outer pole face surrounding
PROBLEM TO BE SOLVED: To provide a DC magnetron sputtering reactor for sputtering copper, its use, a shield or the like for enhancing self-ionized plasma(SIP) sputtering at low pressure, and a method for applying copper coating to a narrow via or trench by using SIP for a first copper ...
Process for sputtering copper in a self ionized plasmaUS6582569 Oct 10, 2000 Jun 24, 2003 Applied Materials, Inc. A DC magnetron sputter reactor for sputtering copper, its method of use, and shields and other parts promoting self-ionized plasma (SIP) sputtering. Also, a method of coating ...
A DC magnetron sputter reactor for sputtering copper, its method of use, and shields and other parts promoting self-ionized plasma (SIP) sputtering, preferably at pressures below 5 milliTorr, preferably below 1 milliTorr. Also, a method of coating copper into a narrow and deep via or trench...
the particles sputtered from the target are substantially ionized and are themselves used to sputter the target. In sustained self-sputtering, a working gas such as argon is admitted to the chamber to ignite the plasma, but once the plasma is ignited the chamber pressure is substantially reduced...