Scribe是一种切割方式，用于半导体制造流程 Scribe line width指的是切割的时候切出来的那一条缝隙的大小
【光刻百科】光源掩模协同优化 Source Mask Optimization (SMO) 【光刻百科】边缘粗糙度 Line Edge Roughness (LER) 【光刻百科】线宽粗糙度 Line Width Roughness (LWR) 【光刻百科】套刻误差 Overlay 【光刻百科】掩模误差增强因子 Mask Error Enhancement Factor,MEEF 【光刻百科】计算光刻 ComputationalLithography 【...
aThe scribed line should be exactly 0,5 mm wide for both vertical and horizontal scribe. Independent of which standard that is used. 划线的线应该确切地是0,5毫米宽为垂直和水平的抄写员。 独立,其中使用的标准。[translate]
die for at least the two matched devices in the matched component portion and alters the layout on the IC die for a portion of the first subcircuit other than the matched devices in matched component portion to fit the TM layout of the first subcircuit within the scribe line width dimension...
Scriber line width ≤30μm Laser repetition frequency 30KHz~60KHz Maximum Scribing speed ≤600mm/s Work platform size 180*180mm Power AC220V/50HZ/2.5KW Cooling method Air-cooling Work table Single gas chamber negative pressure adsorption Characteristics Suitable for crystalline ...
In this study, a systematic method for optimizing multi-objective process parameters of fiber laser system was proposed to achieve excellent quality characteristics, such as the minimum scribing line width, the flattest trough bottom, and the least processing edge surface bumps for increasing incident...
专利名称：Semiconductor wafer having scribe line test modules including matching portions from subcircuits on active die 发明人：Tathagata Chatterjee,Joseph P.Ramon,Patricia Vincent 申请号：US12760650 申请日：20100415 公开号：US08134382B2 公开日：20120313 专利内容由知识产权出版社提供 专利附图：摘要：A ...
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Pads with different width in a scribe line region and method for manufacturing these pads Test structures for semiconductor devices, methods of forming test structures, semiconductor devices, methods of manufacturing thereof, and testing methods for semiconductor devices are disclosed. In one embodiment,...
(not shown) followed by severing or breaking along the line 13. The "streets" 3 and 5 generally have a width in the range of about 3 to 5 mils to accommodate for some misalignment of the scribing apparatus as well as to minimize surface damage to the chip from sawing or the like. ...