拜登任期即将结束,《芯片法案》效果如何? 两年前,美国总统拜登签署了《芯片和科学法案》(CHIPS and Science Act,简称《芯片法案》),旨在重建美国在半导体制造领域的领导地位,支撑全球供应链,并加强国家和经济安全如今拜登任期即将结束,而在他的任期内极力推动和落地了《芯片法案》。 如今美国芯片法案签署两周年,效果如何...
当地时间2024年8月9日,在美国拜登总统签署《芯片与科学法案》(CHIPS and Science Act)两周年之际,美国白宫公布了这项配套有530亿美元补贴资金的法案,在这两年内所取得的成绩:相关企业在半导体和电子领域已经宣布投资额超过了3950亿美元,并创造了超过 115,000 个工作岗位。 美国白宫在官方新闻稿中指出,两年前,拜登...
(CHIPS Act), signed into law on August 9, 2022, aims to power the engines of US innovation and global competitiveness through the construction of new microprocessor manufacturing and R&D facilities, expanding the nation's science and technology base, creating new regional high-tech hubs and a ...
美国国会通过了《2022年芯片和科学法》（The CHIPS and Science Act of 2022），该法分成A、B、C 三个部分，A部分为《2022年芯片法案》（CHIPS Act of 2022），B和C部分为《研究与创新》（Research & Innovation）和《补充拨款以应对对美国最高法院的威胁》（Supplemental Appropriations to Address Threats to t...
DIVISION A - CHIPS ACT OF 2022 DIVISION B - RESEARCH & INNOVATION TITLE I - DEPARTMENT OF ENERGY SCIENCE FOR THE FUTURE TITLE II - NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY FOR THE FUTURE ACT Subtitle A – Appropriations Subtitle B – Measurement Research ...
(CHIPS Act), signed into law on August 9, 2022, aims to power the engines of US innovation and global competitiveness through the construction of new microprocessor manufacturing and R&D facilities, expanding the nation's science and technology base, creating new regional high-tech hubs and a ...
DIVISION A - CHIPS ACT OF 2022 DIVISION B - RESEARCH & INNOVATION TITLE I - DEPARTMENT OF ENERGY SCIENCE FOR THE FUTURE TITLE II - NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY FOR THE FUTURE ACT Subtitle A – Appropriations Subtitle B – Measurement Research ...
CHIPS 是Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Fund的缩写。其意思是“创建协助激励生产半导体的美国基金” 。很多中文网站大都描述为芯片法案,着重描述和中国的的芯片战。 其实,这个法案包含三个部分: DIVISION A - CHIPS ACT OF 2022 (2022年芯片法案) DIVISION B - RESEARCH...
GlobalFoundries (Nasdaq: GFS) (GF) announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
美国国会众议院7月28日正式通过《芯片与科学法案》(CHIPS and Science Act),简称《芯片法案》,并在8月9日由拜登最终签署成为美国法律。在总额为2800亿美元的法案里,527亿美元在2022-2026年间将用于补贴建设和更新晶圆厂,以促进半导体制造回流美国,并支持半导体研究和国防创新等相关领域。