announced Thursday (Dec. 20) that it has taped out multiple test chips ranging from a full ARM Cortex A7 processor implementation (using the low-power component of the ARM's "big-little" processor configuration/technology) to a SRAM-based chip capable of operation near threshold voltage...
The A14 5G is built for speed thanks to the Octa-core chip and the latest 5G connectivity; gameplay and streaming are super smooth thanks to this serious processing power. The 6.6” FHD+ Infinity-V display ensures that nothing gets in your way, letting you experience all your favourite ...
*Based on test conditions for submersion in up to 1 metre of freshwater for up to 30 minutes. Not advised for use in beaches, pools or near soapy water. Safe against low water pressure only.What’s the difference between the Samsung A Series and S series? The main difference between the...
3, 2022 -- To drive adoption of Samsung's 3nm gate-all-around (GAA) technology for designs requiring optimal power, performance and area (PPA), Synopsys, Inc. (Nasdaq: SNPS) today announced that its longstanding collaboration with Samsung Foundry has produced multiple successful test chip ...
(the one we tested), and the Wi-Fi model relies on a Qualcomm Snapdragon 778G processor. The Snapdragon 778G is a newer chip with updated Arm cores, a newer GPU, and other improvements compared to the Snapdragon 750G. Based on the raw specs and comparison benchmarks with other ...
QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale TSMC Unveils Next-...
While it only got the Apple A16 chip found in iPhone 14 Pro and iPhone 15, not one of Apple's more powerful M-Series chips -- that's a performance bump from the A14 processor in the 10th-gen iPad. Just as importantly, the base version of the iPad 11th-gen comes with 128GB of ...
(NASDAQ: CDNS) today announced that the complete Cadence® advanced packaging design and analysis tool flow is certified by Samsung Foundry for Fan-Out Panel-Level-Packaging (FO-PLP) and silicon-interposer 2.5D package. This proven on-/off-chip design flow is in use now by multiple ...
Edoardo Maggio
En los test, estos gráficos contaban con 6 CUs, que se traducen en 384 Stream Processors que funcionaban a una frecuencia de 1,31 GHz. Básicamente, debería ser más potente que los gráficos de sus APUs de sobremesa y portátiles en la actualidad. Se conoce que ...