Flux impact- Solder paste relies on the flux to activate cleaning and wetting during soldering. The reflow profile needs to consider the activation and burn-off characteristics of the flux. Solder spheres don't require flux in them internally for reflow. ...
The quality of the solder joint is influenced by the parameters that govern the reflow profile, which are ramp rate, soak time, time above liquidus time, peak temperature and cooling rate. If the reflow profile is not properly optimized, defects such as voids in the solder joint can pose a...
Wide reflow profile window with good solderability Excellent solder and flux cosmetics after reflow soldering Compatible with either nitrogen or air reflow ALPHA OM-338PT Specifications: Series: OM-338-PT Product type: Lead free solder paste Physical form: Paste Chemical composition: SAC305 Container:...
Fitech has rich research and development resources and instruments for producing solder pastes and can provide customers with various customized solder paste products, such as SAC305 and SnBi57.6Ag0.4. Besides, Fitech can optimize the reflow profile and provide soldering process improvement suggestions ...
reflow, using ramp and soak profiles, as high as 175 to 185°C Reduced Random Solder Ball Levels: minimizes rework and increases first time yield Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak profile environment Excellent Solder ...
It takes 100±20 minutes to make the solder paste stay on the printed circuit board before the reflow soldering process begins. Chemical Component Data Sheet Type Chemical Composition (wt. %) Sn Pb Sb Cu Ag Fe Al Cd Sn96.5Ag0.3Cu0.5 Bal < 0.1 < 0...
限轉換之影響因素 合金焊接金屬相限 SAC305合金焊接金屬相 黃潤昕/廣上廠區專案室 2010/8/16 *** 通過本章節瞭解如下的知識：1.2種不同的IMC是什麼？各有什麼特性及差異？2.IMC形成的最大影響因素是什麼？怎樣影響？3.怎樣來計算IMC厚成長率？4.最佳的焊接條件是什麼？5.阿侖尼烏斯方程式？*** 關鍵字...
Fitech's solder paste Fitech has rich research and development resources and instruments for producing solder pastes and can provide customers with various customized solder paste products, such as SAC305 and SnBi57.6Ag0.4. Besides, Fitech can optimize the reflow profile and provide soldering process...
The nano-reinforced particles introduced in the Sn-3.0Ag-0.5Cu (SAC305) solder is titanium oxide (TiO 2 ) nanoparticles with approximate diameter of ≈20nm at different weight percentages of 0.01, 0.05 and 0.15wt% respectively. The 3D model developed is based on the reflow thermal profile of...