图片仅供参考,请参阅产品规格。 Memory - Configuration Proms for FPGAs 制造商 :AMD Xilinx, Inc 封装/规格 :DIP-8 产品分类 :Memory - Configuration Proms for FPGAs Datasheet:XC17S200APC Datasheet (PDF) RoHs Status:Lead free / RoHS Compliant ...
DSYK Model Number XC17S200APC Mounting Type standard Description standard Application standard Type standard Series standard Features standard Manufacturing Date Code 2024+ Packaging and delivery Selling Units: Single item Single package size: 21X14X7 cm Single gross weight: 0.100 kg Show more ...
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17S200APC Operating Temperature -40-85C Application Communications Equipment D/C New Type Electronic components Package standard Packaging and delivery Packaging Details Standard Port HongKong or Shenzhen Supply Ability Supply Ability 10000 Piece/Pieces per Week Show more Ratings...
XC17S200APC Operating Temperature -40-85C Application Communications Equipment D/C New Type Electronic components Package Standard Supply Ability Supply Ability 10000 Piece/Pieces per Week Show more Ratings & Reviews Product reviews Store reviews 5.0/5.0Very satisfied Supplier service 5.0 On-time ship...
Brand Name original brand Model Number XC17S200APC Mounting Type - Description - Application board Type - Series - Features - Manufacturing Date Code - Packaging and delivery Selling Units: Single item Single package size: 1.00X1.00X1.00 cm Single gross weight: 0.010 kg Show more ...