Microelectronics ReliabilityJan. 1, 1992, Wu, " Resistance Computations for Multilayer Packaging Structures by Applying the Boundary Element Method ", IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 15.1, pp. 87-96....
Resistance modeling of periodically perforated mesh planes in multilayer packaging structures: Ruey-Beei Wu.IEEE Trans. Compon. Hybrids mfg Technol.12(3), 365 (1989)doi:10.1016/0026-2714(90)90633-xELSEVIERMicroelectronics Reliability
Quick inspection of power plane short fault on multilayer substrate: Fang-Lin Chao and Ruey-Beei Wu. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 466 (September 1995).The scale was first developed in 1928 and was based on the "best" and "...