Thereby, the strain created in the resin section 5 by the pressure of water vapor 6 is decreased and reflow cracking of the resin section 5 can be prevented.KITANO MAKOTO北野 誠KAWAI SUEO河合 末男NISHIMURA ASAO西村 朝雄MIURA HIDEO三浦 英生TATEMICHI AKIHIRO立道 昭弘...
Metal component null for ri - dohure - mu 来自 掌桥科研 喜欢 0 阅读量: 10 申请(专利)号: JP19830061177 申请日期: 1983-04-07 公开/公告号: JPH0770661B2 公开/公告日期: 1995-07-31 申请(专利权)人: 古河電気工業株式会社 发明人:松田 晃,志賀 章二 ...
Copper alloy null for ri - dohure - mu PURPOSE:To provide a titled copper alloy having excellent electrical and thermal conductivity, heat resistance, bendability, plating adhesion and solderabi... 岩井 博久,赤坂 喜一,篠崎 重雄 被引量: 0发表: 1994年 Production manner null of copper alloy ...
专利名称：hu - pu condition ri - dohure - mo in mu -formation device null of the rudo 发明人：MURAKAMI TADASHI,村上 忠司 申请号：JP特願平2-231472 申请日：19900831 公开号：JP第2585850号B2 公开日：19970226 专利内容由知识产权出版社提供 摘要：PURPOSE:To enable accurate registration of a top ...
Then, the length of the wire 8 becomes short, and the deformation of the wire 8 due to the injecting pressure of a molding resin can be prevented. Thus, the electric characteristics can be improved.野世 幸之
ri - dohure - mu semiconductor patsuke which uses that - ji(57)< Abstract > < Topic > It flows to power lead/read or ground lead/readWithout making the tonnage of electric current per unit time decrease, at the same timeSimultaneously without decreasing the frequency of the Drive which ...
Semiconductor equipment for high frequency ri - dohure - mu null for the said device Semiconductor equipment for high frequency ri - dohure - mu null for the said devicePURPOSE:To obtain the title semiconductor device and lead frame easy ... M Fumio,宮川 文雄,T Toshiichi,... 被引量: ...
Semiconductor equipment for high frequency ri - dohure - mu null for the said device Semiconductor equipment for high frequency ri - dohure - mu null for the said devicePURPOSE:To obtain the title semiconductor device and lead frame easy ... M Fumio,宮川 文雄,T Toshiichi,... 被引量: ...
As a result, the deformation reaching the entire lead frame, especially on both outer frame parts 1, can be prevented.YANO HIDEYOSHI矢野 栄喜
The ends are formed in circular shape to allow the bonding position of a semiconductor chip 1 with recessed electrode to displace laterally of the fingers 4.山下 康雄鈴記 正義坂田 栄二嶋津 博士