of a mold cavity and to enhance product yield by forming a vacuum suction chamber and the partition chamber of heating and cooling medium introducing chambers in the axial direction of a mold by using porous sintered metal in a space chamber and packing the partition chamber with porous sintered...
RESIN COMPOSITION FOR MOLDING MATERIAL 专利名称：RESIN COMPOSITION FOR MOLDING MATERIAL 发明人：ARAI SHIGEHARU,新井 重治,OKUBO TAKANOBU,大窪 孝信 申请号：JP特願平11-276982 申请日：19990929 公开号：JP特開2001-98167(P2001-98167A)A 公开日：20010410 专利内容由知识产权出版社提供 摘要：Array 申请人：...
;CONSTITUTION: On a part for molding the rear surface of a product in the vicinity of a thick-wall part where sink marks are easily generated on a product, an insert 4 made of a material having a thermal conductivity smaller than that of a material of a mold is provided so that the ...
The resin is cured in the mold cavity by maintaining the evacuated state in the brim cavity for an amount of time sufficient to cure the resin.doi:US6299819 B1Kerang Ken HanUSUS6299819 1999年6月18日 2001年10月9日 The University Of Dayton Double-chamber vacuum resin transfer molding...
CFRP manufacturing method using electrodeposition resin molding for curvilinear fiber arrangements Thermosetting resin3-Dimensional reinforcementOut of autoclave processingRecently, theoretical and experimental methods were proposed for organizing carbon fibers in... K Katagiri,K Sasaki,S Honda,... - 《Compos...
网络释义 1. 树脂传递成型 POLYMER - 瑞的日志 - 网易博客 ... 传递成型 transfer molding树脂传递成型resin transfer molding铸塑 cast ... qiudunrui.blog.163.com|基于49个网页 2. 树脂传递模塑 树脂传递模塑,resin... ... ) resin transfer moulding 树脂传递模塑 )resin transfer molding树脂传递模塑) ...
PURPOSE:To cause a parting line not to deviate by a method in which the beads for parting line which project into the cavity at the mold surface of a mold for resin molding and define the boundary of coating, is provided, and masking is achieved along this beads for parting line. CONSTIT...
MOLD FOR EXTRUSION MOLDING OF THERMOPLASTIC RESIN PIPE PROBLEM TO BE SOLVED: To provide an extrusion mold not having possible inconvenience such that a deposit due to so-called build-up phenomenon is bonded to ... Y Ayumi,山根 歩 被引量: 0发表: 2000年 MOLD FOR MOLDING THERMOPLASTIC RESIN ...
MOLD FOR MOLDING RESIN 专利名称：MOLD FOR MOLDING RESIN 发明人：KURIHARA TSUNEO,栗原 恒夫,NAGASHIO RYUZO,長塩 隆三,SUZUKI KUNIMIKI,鈴木 國 幹,NAKAZAWA JUNZO,中沢 順三 申请号：JP特願平11-57137 申请日：19990304 公开号：JP特開2000-246770(P2000-246770A)A 公开日：20000912 专利内容由知识产权...
MOLD FOR MOLDING RESINMOLD FOR MOLDING RESIN 申请(专利)号: JP19850288368 申请日: 1985-12-20 专利号: JPS62146606A 公开公告日: 1987-06-30 主分类号: B29C33/40 分类号: B29C33/40; B29C33/42; B29C41/12; B29K105/12 申请权利人: TANAZAWA HATSUKOUSHIYA:KK 发明设计人: SOGABE MITSUYUKI;...