sensors Article A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications Shuai Shao 1,*,†, Dapeng Liu 1,*,†, Yuling Niu 1, Kathy O'Donnell 2, Dipak Sengupta 2 and Seungbae Park 1 1 Department of Mechanical Engineering, State University of New ...