Profile的源由 焊接 利用一種或多種的元素組合透過化學與物理變化將兩種以上的物質結合在一起。目前就各種形式的合金焊料，其最權威的國際規範為J-STD-006。因其實用性與資料的更新速度在業界中已取代了先前甚為知名的美國聯邦規範QQ-S-571。IPC還有一份重要的焊接手冊IPC-HDBK001中，曾定義『熔點』在430℃...
這是典型的回流曲線基於 IPC/JEDEC J-STD-020 修訂於 （2008 年 3 月）。它僅僅作為一個指導參考。有關詳細信息，及最新資訊，請參閱以下網站：www.jedec.org.典型 RoHS 回流焊曲線 典型 RoHS 回流焊曲線TOKEN 50 100150200250 217 300 T e m p e r a t u r e (°C )Time (seconds)Preheat / ...
IPC-A-610 Class 2/3 high-quality lead-free PCB assembly including SMT and THT for automotive, medical, industrial, communication, defense, aerospace, and consumer electronics. One-on-one engineering support for your lead-free projects, with free DFM, DFT, and DFX. The whole EMS process is ...
Reflow the board and measure the real time thermal profile simultaneously. Check the solder joint quality, PCB and component status. Burn-in a test board with thermal shock and mechanical shock to check the board’s reliability. Compare real-time thermal data with the virtual profile. ...
1. 錫膏(或紅膠)廠商的建議Profile 2. 貴重零件(廠內通常定義為:BGA類零件;如:芯片 組、GPU)供應商的建議Profile 3. 業界的標准,如IPC等國際標准 4. 產品的實際良率 丹愚蚌粹摘瞧瓢遵迪精堑饲洱疵蒜沃喻翠拍兔闽岂枷茵让朵双丽就芒墟椎Reflow最佳参数设定Reflow最佳参数设定 ...
IPC(reflow) 4th 1. 無鉛錫膏 SnAgCu-免洗、flux 量多。 SnAgBi-(日本)室溫強度、低熔點。 2. 無鉛溫度 profile 曲線形式:preheat-soak-spike(SnAgCu) 預熱區(preheat):升溫-1℃~2℃/秒。 均溫區(soak):需 0~60 秒。 熔錫區(spike):進入 215℃熔錫溫度的斜率會到達 3.5℃/秒。 峰值溫度:235~250...
This work provides a systematic study of surface finish (Immersion Sn and Immersion Ag) and reflow profile (cool down rate) on the drop test reliability of CSP assemblies. The Sn finish provides an initial Cu-Sn intermetallic layer, while the Ag finish allows the formation of the initial Cu...
Consult IPC/JEDEC J-STD-033C for baking times based on the thickness of the device, the MSL rating of the device, and the baking temperature. Devices in tape and reel, trays, or tubes may not be baked at any temperature higher than 40°C. SLVA840 – January 2017 Submit Documentation ...
RoHS Compliant Solder Reflow Profile - SMD Trimpot® Products Process Description 1. Apply solder paste to test board (8 - 10 mil thick) 2. Place test units onto board 3. Ramp up 4. Preheat (TS) 5. Time above liquidus (TL) 6. Peak temperature (TP) 7. Ramp down 8. Cleaning ...
You will require suitable reflow profile conditions. Be sure to have a PCB element footprint design. Get a detailed and well-designed printed PCB. Have options for repeatable placement for surface mount components. Ensure that your PCB is high-quality. Select high-quality solder paste. Still hav...