We have proposed a new three-dimensional (3D) integration technology based on reconfigured wafer-on-wafer bonding technique to solve several problems in 3D integration technology using the conventional wafer-on-wafer bonding technique. 3D LSIs are fabricated by bonding the reconfigured wafers onto the...
Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration 喜欢 0 阅读量: 34 作者:Tetsu,TANAKA,Takafumi,FUKUSHIMA,Kangwook,LEE,Mitsumasa,KOYANAGI 摘要: In order to solve the critical issues of current s 关键词:...
Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.Jens PohlEdward FuergutMarkus BrunnbauerThorsten MeyerPeter StrobelDaniel PorwolUlrich Wachter...
Fuergut, EdwardBrunnbauer, MarkusMeyer, ThorstenStrobel, PeterPorwol, DanielWachter, UlrichUSUS7943423 * Mar 10, 2009 May 17, 2011 Infineon Technologies Ag Reconfigured wafer alignmentUS7943423 Mar 10, 2009 May 17, 2011 Infineon Technologies Ag Reconfigured wafer alignment...
PROBLEM TO BE SOLVED: To provide a molded reconfigured wafer, capable of simplifying a manufacturing process and decreasing a manufacturing cost, and a stack package using the wafer, and a method for manufacturing the stack package.KIM JONG-HOON...
A mold reconfigured wafer and a stacked package using the same are provided to make a manufacturing process simple and use a semiconductor chip of general purpose by implementing a stacked package by using a mold reformed wafer without manufacturing a wafer in which a separate device design which...
PROBLEM TO BE SOLVED: To provide a stack package manufactured using a molded reconfigured wafer, simplified in manufacturing process and capable of being decreased in manufacturing cost, and a method for manufacturing the stack package.KIM JONG-HOON...
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WAFER LEVEL RECONFIGURED MULTICHIP PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOFA method of manufacture of an integrated circuit packaging system includes: removing a portion of a leadframe to form a partially removed region and an upper portion of a ...
A case study on a multistage wafer manufacturing process is conducted to illustrate the procedure and effectiveness of the proposed method.doi:10.1080/0740817X.2011.564603RAN JINH. Milton Stewart School of Industrial and Systems EngineeringJIANJUN SHI...
MOLDED RECONFIGURED WAFER, STACK PACKAGE USING THE SAME, AND METHOD FOR MANUFACTURING THE STACK PACKAGEA stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side ...