Be sure to remove the dirt on the PCB surface before scanning to ensure that the IC model and the characters on the PCB are clearly visible in the picture after scanning. Step 2: Disassemble components and make BOM Use a small air gun to heat the component to be removed, clamp it with...
Substrate Termination Replica through Layer-by-Layer Growth. Chem. Mater 24, 4177–4184 (2012). 14. 15. Huijben, M. et al. Critical thickness Park, J.-H. et al. Direct evidence for aanhdalofr-bmiteatlalolircdeferrinrogminagunlterta. tNhiantuLrea03.79Sr20,.37M94n–O739f6ilm(1s9.9...
Use a small air gun to heat the component to be removed, clamp it with tweezers, and let the pipe wind blow it away. Remove the resistor first, then the capacitor, and finally the IC. And record whether any components have been dropped and installed reversely. Before disassembling, prepare...