Electronic packaging in the 1990s—a perspective from America : Rao R. Tummala . IEEE Trans. Compon. Hybrids Mfg Technol. 14 (2), 262 (1991)electronic packaging in the 1990s—a perspective from america: rao r. tummala. ieee trans. compon. hybrids mfg technol.14(2), 262 (1991)...
Discussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988Microelectronic packaging... B Mirman - 《Journal of Electronic Packaging》 被引量: 0发表: 1990年 Plastic packaging of microelectronic devices Plastic packaging of microelectronic devices. Pos...