•Smallfootprint •Betterelectricalperformance •Betterpowerdissipation 结构特点 3 封装考核标准 •PackageLevelMSL •JEDEClevel330°C/60%,192hoursfor PPFleadframe JDEEClevel185°C/85%,168hoursfor Culeadframe •PCT121°C/100%/2atm,100hours ...
封装考核标准 •PackageLevelMSL •JEDEClevel330°C/60%,192hoursfor PPFleadframeJDEEClevel185°C/85%,168hoursforCuleadframePCT121°C/100%/2atm,100hoursTCT-65°C~150°C,1000cyclesHTST150°C1000hoursHAST130°C/85%100hours •••• 封装类型与技术参数 Pkgsize3x316L4x424L5x532L7x748...