Com pa ny In troducti onMarch 2015GigaLane Co Ltd.Company OverviewDom estic leader in each bus in ess unit, expanding it
17、 optimized process technologyMAXIS300LAH ICP or RIE Source<Tray> TRAY to TRAY full aulomatic transfer Application: PSS Etchr GaN Etch, Oxide Etch Optimized Source & Tray Design-Tray Capacity: 2"(23pcs)/ 4*(7pcs)/ 6”(3pcs)-Good Uniformity : St3%i(ln wafer)it 3%1(W to W, R ...