The type of material used is in general closely related to the fabrication technique employed (Fig. 4-1(b)), each having its advantages and limitations. The metal pump has the advantage of fast prototype fabrication and readily available equipment. The fabrication of a pump in silicon can be...
Silicon solar cell process development, fabrication, and analysis. Eighth quarterly report, 1 October 1980-31 December 1980Work included fabrication and ... H Yoo,P Iles,D Leung 被引量: 0发表: 1980年 Deposition, fabrication and analysis of polycrystalline silicon MIS solar cells. Final Report,...
The IDT finger electrode obtained after the completed fabrication step prove that process parameters are suitable and react well with the process development. 展开 关键词: X-ray diffraction annealing crystal growth from solution nanofabrication nanorods scanning electron microscopy surface acoustic wave ...
Three-dimensional packaging (3DP) is an emerging trend in microelectronics development toward system in package (SiP). 3D flip chip stacking structures with through silicon vias (TSVs) have very good potential for the implementation of 3D packaging. Prototype design and fabrication of multi-stacked...
Both the device composition and fabrication process are well-known to crucially affect the power conversion efficiency of polymer solar cells. Major advances have recently been achieved through the development of novel device materials and inkjet printing technologies, which permit to improve their durabil...
Silicon oxycarbide composites reinforced by three-dimensional braided carbon fiber (3D-B Cf/Si-O-C)were fabricated via precursor infiltration and pyrolysis... 马青松,陈朝辉,郑文伟,... - 《中国有色金属学会会刊:英文版》 被引量: 6发表: 2004年 Development and Characterization of Si-Al-O-N-C ...
Fanout Wafer Level Package - FOWLP, is actively pursues in the industry as it offered low profile, better electrical performance and multi-functionality. RDL 1st FOWLP is one of the approaches in fabrication of FOWLP. It offered attractive advantages such as fine pitch interconnects, no die shift...
composition and intrinsic thermofluid properties from the material used in training. The process maps generated by our method, along with the variability maps of molten pool attributes, can potentially accelerate the qualification of printability and process development for newly developed 3D printed ...
semiconductor chip processes. In particular, we create a controlled virtual process game to systematically benchmark the performance of humans and computers for the design of a semiconductor fabrication process. We find that human engineers excel in the early stages of development, whereas the ...
Process Development Engineer-Thin Wafer - K· 薪 上海安世半导体科技 电子/半导体/集成电路 已上市 更换职位 职位关闭 快速封装线经理 - K 季丰电子 电子/半导体/集成电路 B轮 更换职位 职位详情 上海 5-10年 本科 PIE Location: Shanghai Lingang What you will do: • Responsible for developing new pr...