Source-Down PQFN package OptiMOS™功率MOSFET源-降系列具有业界领先的RDS(on)、最佳FOM和卓越的散热性能--PQFN(功率四平无引线) 英飞凌的OptiMOS™低压和中压功率MOSFETs采用创新和改进的PQFN封装,具有源极下降(Source-Down)配置,现已推向市场。Source-Down封装概念的主要特点是硅芯片的有源面朝向元件的底面...
OptiMOS™ power MOSFET Source-Down family with leading RDS(on), superior thermal performance - PQFN (Power Quad Flat No-lead) package improved!”
The PQFN (Power Quad Flat No-lead) is a highly efficient space-saving package designed for a wide range of higher power applications.
The PQFN package also includes bootstrap diodes respectively coupled to the drivers. The bootstrap diodes are in a common integrated circuit (IC) that is situated on the leadframe. The common IC can include the drivers. The drivers can be high side drivers that are coupled to high side ...
The PQFN is a surface mount plastic package with lead pads located on the bottom surface of the package. All PQFN packages have either been designed with a single exposed die pad (flag) or multiple exposed die pads depending on device requirements and intended application. The ...
Outside PQFN Extra PCB Pad Length ཌ䜞PQFN仓ཌPCB ❀ⴎ䮵ᓜ PCPBCBP❀adⴎ 00..1155 mmm PPQQFFNNᕋLe㓵ad PQPFQNFሷN 㻻Package দ⭫䐥ᶵ Printed Circuit Board 图 2. 封装引脚和推荐 PCB 焊盘的横截面 焊盘宽度应比各侧的引脚尺寸标称值 (外壳注明的标称...
The PQFN package also includes bootstrap diodes respectively coupled to the drivers. The bootstrap diodes are in a common integrated circuit (IC) that is situated on the leadframe. The common IC can include the drivers. The drivers can be high side drivers that are coupled to high side ...
AN2467,功率四方扁平无引脚(PQFN)封装-应用说明 © Freescale Semiconductor, Inc., 2007. All rights reserved. Freescale Semiconductor 应用说明Document Number: AN2467 Rev. 4.0，4/2007 功率四方扁平无引脚 (PQFN) 封装目录 1 目的 . . . . . . . . . . . . . . . . . . . . . . ...
未来电力电子系统的设计将持续推进,以实现最高水平的性能和功率密度。为顺应这一发展趋势,英飞凌科技有限公司(FSE代码:IFX / OTCQX代码:IFNNY)推出了全新的3.3 x 3.3 mm2 PQFN 封装的源极底置功率MOSFET,电压范围涵盖25-150 V,并且有底部散热(BSC)和双面
The PQFN package further includes low-side U-phase, low-side V-phase, and low-side W-phase power switches situated on the leadframe. A logic ground of the leadframe is coupled to a support logic circuit of the driver IC. A power stage ground of the leadframe is coupled to sources ...