semiconductor device testingPress-pack IGBTs are increasing their market-share, especially for traction applications. As packaging performance is a key factor for a successful product, there is a great interest
In [42], a better refined lumped thermal model was applied to evaluate the solder degradation in real time for single half-bridge Si-IGBT based inverter topology. However, the work did not demonstrate the thermal interaction between other chips and ignore the influence of lateral heat transfer ...
This module is also equipped with the latest low-loss IGBT M7 chips and achieves high power density. The new VINco E3 line contains the half-bridge VINcoDUAL E3, this new sixpack VINcoPACK E3 and PIM configuration are due to follow. Main benefits: / Extended module lifetime based on ...
The results of the extracted parasitic inductance by the FEM tool show that the parasitic inductance of the Press-Pack IGBT is only 7% of the soldered IGBT module with the same voltage and current rate. The simulated and experimental results show that the discharge current of Press-Pack IGBT ...
Development of high power press-pack IGBT and its applications. International Conference on Microelectronics, 2000, 1: 125～129Y. Uchida, Y. Seki, Y. Takahashi, and M. Ichijoh, "Development of high power press-pack IGBT and its applications," presented at the Int. Conf. Microelectron., ...
W. Kolar, "Optimization of the current distribution in press-pack high power IGBT modules," in Proc. Int. Power Electronics Conf. (IPEC), 2010, pp. 1139-1146.A. Musing, G. Ortiz and J. W. Kolar, "Optimization of the current distribution in press-pack high power IGBT modules," Power...
ISPSD '01. Proceedings of the 13th International Symposium onS. Kaufmann, T. Lang, R. Chokhawala: "Innovative press pack modules for high power IGBTs" Proc. ISPSD, Osaka, 2001S. Kaufmann, T. Lang, R. Chokhawala, "Innovative Press Pack Modules for High Power IGBT's", ISPSD 2001, pp...
A new IGBT press pack package was developed to meet increasingly\nchallenging requirements for high power converters, such as in power\nsystems applications. The package offers significantly high tolerance to\npressure nonuniformity and allows up to 100 kN of stacking pressure\nwhile effectively ...
KAUFMANNS,LANG T,CHOKHAWALA R.Innovative press pack modules for high power IGBTs[C]// IEEE InternationalSymposium on Power Semiconductor Devices andICS,June7,2001,Osaka,Japan:59G62.S. Kaufmann, T. Lang, R. Chokhawala: "Innovative press pack modules for high power IGBTs" Proc. ISPSD, ...
IGBT Applications: Power Transmission 16.1 HVDC Transmission Electricity generated from large power plants is distributed over HVDC transmission lines from the point of power generation to the point of use, such as factories or urban areas. Large towers like those shown in Fig. 16.1 are used to ...