Power and thermal management that uses trigger circuits to activate power telemetry. A power consumption level of a subsystem is monitored using a trigger circuit while power telemetry mode for the subsystem is inactive. When the monitored power consumption level exceeds a threshold, the trigger ...
To effectively limit the high temperature inside a chip, thermal specific approaches, besides low power techniques, are necessary at the chip design level. In this work, we investigate the power and thermal management of System-on- Chips (SoCs). Thermal analysis is performed in a SPICE ...
In addition, thermal management of the electronic system is required to ensure the functionality of an electronic system. Thermal management has become increasingly challenging with the trend toward UAS miniaturization, as demonstrated by MAV units, and the demand for integrating greater control and surv...
The Intel® Core™ Duo processor is the first mobile processor that uses Chip Multi-Processing (CMP) on-die technology to maximize performance and minimize power consumption. This paper provides an overview of the power control unit and its impact on the power-saving mechanisms. We describe ...
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摘要: A power and thermal management system (10) includes an integrated power package (14) which receives bleed air (52), communicates conditioned air to an environmental control air distribution system (12) and selectively communicates electrical power with an electrical distribution system (18)....
Thermal and power managementThermal and power managementIn an example, a method includes determining, by an electronic device, a user experience metric associated with content captured by at least one camera of the electronic device. The method also includes adjusting at least one operating parameter...
The present invention provides a performance, thermal and power management system and method. 其中,所述的性能,热能及功率管理系统应用于集成电路,该系统包括性能电路,感应模块,存储器及性能,热能及功率控制器,其中,该性能电路具有可调节设置,且该性能电路用于当接收到供应电压时,仿真该集成电路的多个操作;感应...
The thermal management of high-power GaN-based light-emitting diodes (LEDs) soldered with Sn-3wt.%Ag-0.5wt.%Cu (SAC305) solder and diamond-added SAC305 solder was evaluated. Diamond addition was found to significantly reduce the surface temperature and total thermal resistance of the LEDs, re...
Thermal and Power Management of Integrated Circuits Part of the book series:Series on Integrated Circuits and Systems((ICIR)) 1856Accesses Abstract In this chapter, we initially discuss the power consumption trends and its impact on junction temperature elevation. Junction temperature plays a pivotal ...