(versus if you had a coating on it). Some contractors spread a commercial polishing compound onto the surface during the final polishing step, to give the floor a bit more sheen. These compounds also help clean any residue remaining on the surface from the polishing process and leave a dirt...
The buffer component is preferably a compound with a pKa in the range of ±1.5, and more preferably a compound with a pKa in the range of ±1.0, relative to the prescribed pH. Such compounds include amino acids such as glycine, arginine, lysine, asparagine, aspartic acid and glutamic acid...
Color Black Hardness 65 Package 3PCS/Pack Life Time 3-6 Months Application Fiber Optic Polishing Rubber Pad Dimensions Polishing Pad 5.0mm Clear Sticky Back Plastic Adhesive Film Double Sided Adhesive Sheets Self Adhesive Rubber Sheet Non Skid ...
A polishing liquid comprises: abrasive grains; a compound having an aromatic heterocycle; an additive (excluding the compound having an aromatic heterocycle); and water, wherein: the abrasive grains include a hydroxide of a tetravalent metal element; the aromatic heterocycle has an endocyclic nitrogen...
When originally poured, the contractor had used a curing compound that left black spots on the surface. Calvert started by grinding the floor deeply enough to get to a clean surface, grinding off the top 1/8 inch or so. "There were 4 rooms, the whole bottom floor of the home," Calvert...
Perfect for cleaning and polishing. Can be used with a polishing compound to produce a smooth finish. Terrific for general polishing and can work with semi-rough finishes to refine them to a smooth luster. Package included: 10 x 60 Grit Sandpapers,...
Color:1.5 inch(40mm) Product sellpoints Efficient Design:Equipped with hook & loop backing for strong adhesion and easy pad changes, enhancing work efficiency. Wide Compatibility:Designed for both rotary and dual action polishers, these pads are compatible with a range of machines. ...
WO2002067309A1 2002-08-29 POLISHING COMPOUND AND METHOD FOR POLISHING SUBSTRATE WO2009131133A1 2009-10-29 POLISHING AGENT AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING AGENT WO2010067844A1 2010-06-17 POLISHING SOLUTION FOR CMP AND POLISHING METHOD USING THE POLISHING SOLUTION WO/2011/071168 ...
The buffer component is preferably a compound with a pKa in the range of ±1.5, and more preferably a compound with a pKa in the range of ±1.0, relative to the prescribed pH. Such compounds include amino acids such as glycine, arginine, lysine, asparagine, aspartic acid and glutamic acid...