In this paper, via bottom crevice, via bottom land etching and electroless copper plating coverage is focused to achieve filled via plating enhancement.Takayuki HazeSeungchul KimChanghyun NamSeokwon AhnJung Hwan ParkSujin KimIPCSamsung Electro-Mechanics Co., LTD Chungnam, South Korea...
So, the cerium hydroxide particles were mainly filled into the inside pores of the substrate. By omitting the calcination step, Pd seeds for electroless plating were in situ planted not only on the substrate wall but also on the cerium hydroxide particles using the commercial activating solutions....
Following the conformal growth of the copper, the remaining open portion of a via can be filled with other materials like polymer or ceramic paste [21]. The resistance of a via with thin lining layer may be too high for certain applications and also the contraction of the via filling ...
The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit. 展开 ...
The plating chamber 724 is filled with the plating liquid Q. When a predetermined voltage is applied between the anode plate 736 and the electric contacts from the plating power source, a plating electric current flows from the anode plate 736 to the substrate W, forming a plated film on ...
XRD patterns of the graphite anode were recorded on a PANalytical X’Pert instrument. The XRD samples were peeled off from the Cu current collector and then sealed with Kapton tape in the argon-filled glovebox beforehand to protect them from the air....
(es). In the preferred embodiment, the apparatus and method are particularly suited for use in the semiconductor industry, but may be utilized wherever the indiscriminate deposition of metal onto surface areas must be avoided and/or where a greater level of control over the deposition of the ...
To obtain a uniform lawn of cells, or to isolate colonies each arising from single cells, 0.1–0.5 ml of liquid culture can be spread over the surface of an agar plate using a bent glass rod and a rotating turntable. A light touch is desirable, and spreading should stop before the glass...
Under diffusion-limitation condition (large current, τD≫τI), however, surface saturation can happen before the particle is fully filled, as the shrinking-core phase separation results in the piling up of inserted Li at the surface.26 Our analysis shows the solid diffusion limitation mechanism...