物理与天体物理3区PHYSICS, APPLIED物理:应用PHYSICS, CONDENSED MATTER物理:凝聚态物理PHYSICS, FLUIDS & PLASMAS物理:流体与等离子体POLYMER SCIENCE高分子科学3区3区3区3区否否 名词解释: 中科院分区也叫中科院JCR分区,基础版分为13个大类学科,然后按照各类期刊影响因子分别将每个类别分为四个区,影响因子5%为1区,...
国际简称:PLASMA PROCESS POLYM 出版周期:Monthly 研究方向:物理 - 高分子科学 出版语言:English 创刊时间:2004 是否预警:否 出版地区:GERMANY 是否OA:未开放 期刊介绍 《Plasma Processes And Polymers》(《等离子工艺和聚合物》)是一本由Wiley-VCH Verlag出版的物理-高分子科学学术刊物,主要刊载物理-高分子科学相关...
Plasma Polymer Surfaces Compatible with a CMOS Process for Direct Covalent Enzyme Immobilization Yin, YongbaiNosworthy, Neil J.Gong, BillBax, DanKondyurin, AlexyMcKenzie, David R.Bilek, Marcela M. M. 68-75 Optimised Plasma Absorption Probe for the Electron Density Determination in Reactive Plasmas...
学科:POLYMER SCIENCESCIEQ232 / 94 66.49% 名词解释: JCR分区是由科睿唯安公司(原汤森路透,2016年易主科睿唯安)每年发布的,设置了254个具体学科,根据每个学科分类按照期刊当年的影响因子高低将期刊平均分为4个区,分别为Q1、Q2、Q3和Q4,各占25%。JCR分区包括自然科学(Science Edition)和社会科学(Social Sciences ...
Plasma Processes and Polymers《等离子体处理与聚合物》 (官网投稿) 简介 期刊简称PLASMA PROCESS POLYM 参考译名《等离子体处理与聚合物》 核心类别 SCIE(2024版), 目次收录(维普), 目次收录(知网),外文期刊, IF影响因子 自引率 主要研究方向物理与天体物理-POLYMER SCIENCE高分子科学;PHYSICS, APPLIED物理:应用...
《Plasma Processes and Polymers》 期刊名缩写:PLASMA PROCESS POLYM 22年影响因子:3.877 issn:1612-8850 eIssn:1612-8869 类别:生物工程技术物理 学科与分区:物理、流体和等离子体(PHYSICS, FLUIDS & PLASMAS) - SCIE(Q1)聚合物科学(POLYMER SCIENCE) - SCIE(Q2)物理学、凝聚态物质(PHYSICS, CONDENSED MATTER) ...
A plasma etch process for etching a workpiece in a processing chamber of a plasma reactor which produces improved photoresist layer etch uniformity and selectivity, reduced faceting of the photoresist, reduced polymer peeling, and reduced etching of exposed barrier layer surfaces. This improvement is ...
OXYGEN-FREE PLASMA DESCUM PROCESS FOR PHOTOSENSITIVE CYCLOTENE~(TM) POLYMER FOR WAFER-LEVEL CHIP SCALE PACKAGING A new plasma descum process, which uses no oxygen and a very small amount of fluorine, has been developed for BCB descum in a wafer level chip scale packag... Jingjun Yang,Phil ...
A plasma etch process etches high aspect ratio openings in a dielectric film on a workpiece in a reactor having a ceiling electrode overlying the workpiece and an electrostatic chuck supporting the workpiece. The process includes injecting a polymerizing etch process gas through an annular zone of ...
1612-8850PLASMA PROCESS POLYMPlasma Processes and Polymers高分子科学POLYMER SCIENCE2物理2详情 1612-8850PLASMA PROCESS POLYMPlasma Processes and Polymers物理:应用PHYSICS, APPLIED2物理2详情 1612-8850PLASMA PROCESS POLYMPlasma Processes and Polymers物理:流体与等离子体PHYSICS, FLUIDS & PLASMAS3物理2详情 ...