1. Phenolic material:it is used for a dielectric layer that uses phenolic resin as adhesive and wood pulp fiber paper as reinforcing material. Its specifications include FR-1, FR-2, XPC, and XXX PC. It can be punched, and it has the advantages of low price and small specific gravity....
玻璃纤维Glass fiber ),及高纯度的导体 (铜箔 Copper foil )二者所构成的复合材料( Composite material)...
PCB Material Composition PCB generally consists of four layers, which are heat laminated together into a single layer.The different types of PCB materials used in PCB from top to bottom includes Silkscreen, Soldermask, Copper and Substrate. ...
PCB material summary including Standard FR4 PCB material, High speed PCB material, High frequency PCB material, metal PCB material, ceramic PCB material and FPC material
Material Classification——Reliability Properties(The traditional classification method) Material Classification——Electrical Properties Material Parameters——Lead-free (Application status: A--bat…
basis material13、预浸材料:prepreg14、粘结片:bonding sheet15、预浸粘结片:preimpregnated bonding sheer16、环氧玻璃基板:epoxy glass substrate17、加成法用层压板:laminate for additive process18、预制内层覆箔板:mass lamination panel19、内层芯...
线路板常用术语 1、Warp与Fill： 经向(Warp),指大料(或Prepreg)的短方向，纬向(Fill)指大料(或Prepreg)的长方向。 2．横料与直料： 多层板开料时将Panel长方向与大料长方向一致的称为直料；将Panel长方向与大料短方向一致的称为横料； 3、Material Thickness(Board Thickness)： 客户图纸或Spec无特别说明的...
PCB material selection is the first step in your design process. Selecting the dielectric material for your design is very important as it can impact the overall performance of the board. To help board designers to determine what sort of material best suits their design needs, we have developed...
PCB基材类词汇中英文对照:1、 基材:base material2、 层压板:laminate3、 覆金属箔基材:metal-clad bade material4、 覆铜箔层压板:copper-clad laminate (ccl)5、 单面覆铜箔层压板:single-sided copper-clad laminate
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