oxidation resistance and wear resistance. Due to the extremely high cost of gold, only Applied to gold finger, local plating or chemical gold, such as bonding pad, etc
51、选择性浸金压膜:Selective Gold Dry Film Lamination 52、镀金:Gold plating 53、喷锡:Hot Air SolderLeveling 54、成型:Profile/Form 55、开短路测试:Electrical Testing 56、终检:Final VisualInspection 57、金手指镀镍金:Gold Finger 58、电镀软金:Soft Ni/Au Plating 59、浸镍金:Immersion Ni/Au / Electr...
Gold fingers serve as the bridge between the PCB and other electronic components, ensuring a reliable electrical connection. These connectors are called “PCB gold fingers” due to the thin layer of gold plating applied to their contact areas. This gold plating provides several key benefits, includ...
1、基材:base material2、层压板:laminate3、覆金属箔基材:metal-clad bade material4、覆铜箔层压板:copper-clad laminate (CCL)5、单面覆铜箔层压板:single-sided copper-clad laminate6、双面覆铜箔层压板:double-sided copper-clad laminate7、复合层压板:composite laminate8、薄层压板:thin laminate9、金属...
这里的金手指当然不是指加藤鹰啦,金手指(Gold Finger,或称Edge Connector)设计的目的,是用来与连接器(Connector)弹片之间的连接进行压迫接触而导电互连,之所以选择金是因为它优越的导电性及抗氧化性,电脑里头的内存条或者显卡版本那一排金灿灿的东西就...
57、金手指镀镍金:Gold Finger 58、电镀软金:Soft Ni/Au Plating 59、浸镍金:Immersion Ni/Au / Electroless Ni/Au 60、喷锡:Hot Air Solder Leveling 61、水平喷锡:HorizontalHot Air Solder Leveling 62、垂直喷锡: Vertical Hot Air Solder Leveling ...
Special Request Blind hole, Gold finger, BGA, Carbon ink, peelable mask, VIP process, Edge plating, Half holes Material Suppliers Shengyi, ITEQ, Taiyo, etc. Common Package Vacuum+Carton Equipment -PCBA -PCB Production process PCB Product Show Rigid PCB, Flexible ...
锡后塞孔后固化PCHPost-cure after S/M Plugging in HASL Process 插头镀金:GFP 小站小站代码小站英文名称 插头镀金贴胶带TPGTape Paste before GFP 激光开窗LCTLaser Cutting on Tape 插头镀金前处理PBGPre-treatment before GFP 插头镀金GFPGold Finger Plating ...
I . 镀金Gold plating i-1 金手指镀镍金( Gold Finger ) i-2 电镀软金(Soft Ni/Au Plating) i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡(Hot Air Solder Leveling) j-1 水平喷锡(Horizontal Hot Air Solder Leveling) j-2 垂直喷锡( Vertical Hot Air Solder Leveling) ...
A1.Process 流程Board Cut 开料→Drill钻孔→Incoming Quality Control (IQC)→Plated Through Hole (PTH) →Panel Plating 整板镀铜→dry film 干膜→patterm plating 图形电镀→Flash Gold Plating 闪金电镀Cu(Copper)/Sn(Tin) Plating →etch 蚀刻→quality control (FIRST)QC →Wetfilm W/F →Legend ( ...