三、英飞凌和 Schweizer Electronic合作片 Infineon’s S-Cell 1200 V CoolSiC Gen2p chips SCHWEIZER 出品的(智能)p² 封装是一种将功率半导体嵌入印制电路板的技术。这种方法不仅仅是一种新封装方法。确切而言,其作用是能根据完全不同的原理来研发电力电子系统。利用智能 p² 封装技术研发的应用可实现高功率...
M. Brizoux et al., " Industrial PCB Development Using Embedded Passive & Active Discrete Chips Focused on Process and DfR ", Proceedings of IPC APEX Conference, Las Vegas, USA, April 2010.M. Brizoux, A. Grivon, W. C. Maia Filho, E. Monier-Vinard, J. Stahr, M. Mori...
the Mini Drone Motherboard is ideal for developers and drone enthusiasts looking to push the boundaries of unmanned aerial technology. With an elegant X-frame design, wireless connectivity options, and embedded intelligence, it simplifies complex integrations while ensuring smooth and stable functionality...
"一切都必须同时扩展-本地互连、全局互连以及通过 TSV 的垂直连接。
The PCEA Portland chapterwill host John Andresakis of Ohmega-Ticer for our monthly Zoom meeting on April 24. He will speak on embedded resistance. BOARD BUYING Taxes v. Tariffs: Which is Better for PCB Investment? I recently sat with Shane Whiteside, president and CEO of Summit Interconnect,...
PCIe 采用了差分信号对数据进行收发；并且，除了差分总线，PCIe还引入了嵌入式时钟的技术（Embedded Clock...
PCB Scientist provides Services such as Custom Electronic Design, PCB Design, IoT Product Design, Embedded Systems Design, Firmware / Software development, Prototyping & Contract Manufacturing Services.Company Expertise:PCB Design, fabrication, assembly, Design Training & repair Components & instruments ...
Embedded User Interface Design / lSystem Hardware Design JX offers pcb production services from 1-32 layers Rigid, 1-8 Layers flexible, 1-16 Layer Rigid-Flex pcb. The materials include FR4, High TG, Halogen-free, High frequency (Rogers, Arlon\Taconic...
Embedded User Interface Design / lSystem Hardware Design JX offers pcb production services from 1-32 layers Rigid, 1-8 Layers flexible, 1-16 Layer Rigid-Flex pcb. The materials include FR4, High TG, Halogen-free, High frequency (Rogers, A...
1. A printed circuit board (PCB) substrate, comprising: at least one pre-preg layer interposed between one or more electrically conductive layers; power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration; and a flat heat pipe positioned...