pitch on the PCB allows the design to stay above the minimum line and space fabrication design ...
C., Foundations of Microstrip Circuit Design, Second Edition, John Wiley & Sons, 1992. • IPC-D-317A, Design Guidelines for Electronic Packaging Utilizing High Speed Techniques, 1995. • Wadell, B. C., Transmission Line Design Handbook, Artech House, 1991. • Johnson, H., Why Digital...
All authors contributed to the study conception and design. Material preparation, data collection and analysis were performed by Camila F. Rodrigues, Maria C. Vilas Boas and Lucian Blaga. The first draft of the manuscript was written by Camila F. Rodrigues and all authors commented on previous ...
Johnson ,"High-Speed Digital Design - A Handbook of Black Magic" ; 2.Stephen H. Hall ,"High-Speed Digital System Design" ; 3.Brian Yang,"DigitalSignal Integrity" ; 4.DooglasBrook, "Integrity Issues and 33、 printed Circuit Board Design"。17、两个常被参考的特性阻抗公式:a. 微带线 (...
Is there any recommendation on power supply design, for example like choosing between LDO and switching regulator? I couldn't find any recommended decoupling capacitor in the handbook. Has anyone done any FPGA board design can advise here? 0 Kudos Reply All forum topics Previous topic Next ...
1.http://developer.intel.com/design/chipsets/applnots/pcd_pres399.pdf 2. http://www.Polarinstruments.com/index.html (点选Application notes) 11、在高速PCB设计中,信号层的空白区域可以敷铜,而多个信号层的敷铜在接地和接电源上应如何分配? 一般在空白区域的敷铜绝大部分情况是接地。只是在高速信号线旁敷...
1.http://developer.intel.com/design/chipsets/applnots/pcd_pres399.pdf 2.http://www.Polarinstruments.com/index.html(点选Application notes) 7.关于高速PCB设计中信号层空白区域敷铜接地问题.在高速PCB设计中,信号层的空白区域可以敷铜,那么多个信号层的敷铜是都接地好呢,还是一半接地,一半接电源好呢?
Design for Manufacturing Handbook 10 Chapters - 40 Pages - 45 Minute Read What's Inside: Annular rings: avoid drill breakouts Vias: optimize your design Trace width and space: follow the best practices Solder mask and silkscreen: get the must-knows ...
Johnson,“High-Speed Digital Design – A Handbook of Black Magic”; 2.Stephen H。Hall,“High-Speed Digital System Design”; 3.Brian Yang,“Digital Signal Integrity”; Q34:在电路板尺寸固定的情况下,如果设计中需要容纳更多的功能,就往往需要提高PCB的走线密度,但是这样有可能导致走线的相互干扰增强,...
Wadell, B. C., Transmission Line Design Handbook, Artech House, 1991 Johnson, H., Why Digital Engineers Don't Believe in EMC, IEEE EMC Society Newsletter, Spring, 1998 Lau, J. H., Ball Grid Array Technology, McGraw-Hill, 1995. ! IEEE EMC Society web page at www.emcs.org. Henry ...