Image Transfer 图象转移 Component Side(C/S) 元件面 Artwork 底片 Solder Side(S/S) 焊接面 Mylar 胶片 Matte Solder Mask 哑绿油 Silkscreen/legend/Component Mark 文字 Hole breakout 破孔 Fiducial mark 基点,对光点 Scrubbing 磨板 Expose 曝光 Developing 显影 内层制作 Core material 内层芯板 Thermal pad...
(首板) 77.Dry film 干菲林,干膜 78.LPI=liquid photo image 液态感光=湿绿油 79.Multilayer 多层板 80.SMD=surface mouted device 贴片,表面贴装器件 81.SMT=surface mouted technology 表面贴装技术 82.Peelable mask=blue gel 蓝胶 83.Tooling hole 工艺孔,管位,定位孔,工具孔 84.Fiducial mask 测光点...
Stack-up by zone for flex and rigid-flex designs In the Allegro® PCB Editor 17.2-2016 release, multiple zones can be created using the new Cross-Section Editor to represent rigid-flex-rigid PCBs. A physical zone is used to map an area of the design to one of the stackups created ...
Design Item ID - the identification of the chosen component. Source - displays the name of the server in which the chosen component has been placed. Description - displays the description of the component, which can also be seen in the Components panel. Swapping Options Enable Pin Swapping...
6. Apply soldermask LPI(liquid photo imageable液态感光阻焊剂) and SMOBC(soldermask over bare copper 裸铜覆盖阻焊工艺) soldermask to be per IPC-SM-840,class T,colour : transparent(明晰的) green。All exposed conductive(传导的) surfaces to be solder coated(涂上一层的)。 7. Warp(弯曲) or...
关键词:POB;计算机图像处理;模式识别建盼 AbstractWit}lthedevelopmentofcomputerandimageacquisitiontechnologyimageprocessingextendsitsprimitiveapplyinginimprovingqualityofimagetoresolvingproblemsinmanyfieldsofscienceandtechnologysuchasmedicalimageanalysis.fingerprintidentification,qualityinspectionofproducts,andSOon.Becauseofmany...
¾SMT : Surface Mount Technology 表面安裝技術 ¾MIL : Military Standard 美國軍用標准 ¾LPI : Liquid Photo Imageable Solder Mask 液態感光阻焊油 ¾SMOBC : Solder Mask On Bare Copper 裸銅覆蓋阻焊工藝 ¾OSP : Organic Solderability Preservative 焊錫性有機保護劑 ¾PTI :...
The company also invests in PCB simulation software in order to achieve timely fault identification during PCB design, resulting in fewer redesigns and accelerated development. The Lab continuously targets on improving infrastructure organization in order to reduce development time-and on designing products...
Unfortunately, such challenges are very difficult to overcome with existing traditional computer vision (CV) and image understanding methods for component detection and identification, alone [4]. Though different machine learning (ML) and deep learning (DL) based approaches have shown significant ...
Since each PCB component image captured by different AOI machines with different light sources will have many different styles, if the style difference is too large, the possibility of prediction error will increase. To solve this problem, the image augmentation method will be used in the model’...