Using adhesive made up of part a and part b mixed together, wherein part a includes 12-99% by weight bisphenol a or f type epoxy resin, part b includes 6-99% by weight amidoamine curing agentdoi:US6491783 B2A laminating and coating system is employed with a gravure or flexographic set...
TWO-PART ADHESIVE: PART A-MONOMER,TOUGHENER(S), OPTIONAL ADHESION PROMOTOR AND REDUCING AGENT; PART B-EPOXY RESIN TWO-PART ADHESIVE: PART A-MONOMER,TOUGHENER(S), OPTIONAL ADHESION PROMOTOR AND REDUCING AGENT; PART B-EPOXY RESINEpoxy-modified, two-part acrylic ......
Epoxy resin constituent null for note forma PROBLEM TO BE SOLVED: To provide an epoxy resin composition for casting having a low linear expansion coefficient, excellent in thermal impact resistance, giving a suitable resin viscosity as a liquid resin and highly reliable, and there... 竹内 彰久 ...
PROBLEM TO BE SOLVED: To provide an epoxy resin molded material for sealing and electronic part device in which the characteristic evaluated by a bias test or the like under an elevated temperature and humidity is improved and thereby the operating life is elongated and which is excellent in moi...
PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material which is excellent in flame retardance, moldabilty, high-temperature aging charactristics, and moisture resistance by using a polyepoxy resin, a compound having phenolic hydroxy groups, a phosphonate, and a specified amount of an ...
PROBLEM TO BE SOLVED: To realize dehalogenation and de-antimony reaction and obtain the subject material capable of developing excellent environmental protection property and high-temperature storage characteristics without impairing flame retardance by compounding an epoxy resin with a specific cyclic phosphaz...
摘要: PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing, having excellent fluidity without reducing curability, and excellent resistance to solder reflow; and to provide a device of an electronic part equipped with an element sealed therewith....
leaving characteristics, etc., and an electronic part apparatus equipped with an element sealed thereby.;SOLUTION: The epoxy resin molding material comprises (A) an epoxy resin, (B) a curing agent and (C) a complex metal hydroxide as essential components and has ≥80 mm circular plate ...
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART DEVICE PROBLEM TO BE SOLVED: To provide an epoxy resin molded material for sealing and electronic part device in which the characteristic evaluated by a bias test or the like under an elevated temperature and humidity is improved and the...
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which has good fluidity and moldability and can decrease its warpage deformation even when used for sealing an electronic part device (e.g. a BGA of a batch mold type); and an electronic part device having an ele...