PACKAGE_TOP:=$(EPICS_PACKAGE_TOP) endif endif 5 changes: 5 additions & 0 deletions 5 src/defs.mak Original file line numberDiff line numberDiff line change @@ -219,3 +219,8 @@ CPSW_LIBS+=tirpc CPSW_STATIC_LIBS+=tirpc LDFLAGS+=-ltirpc endif # Check that we have PACKAGE_TOP, ot...
package top (301), a package pad surface (302), and package sidewalls (303), wherein the package sidewalls (303) extend from the package pad surface (302) the package top (301) extend; a leadframe structure (31) configured to electrically and mechanically couple the package (300) to ...
the top of the package 青云英语翻译 请在下面的文本框内输入文字,然后点击开始翻译按钮进行翻译,如果您看不到结果,请重新翻译! 翻译结果1翻译结果2翻译结果3翻译结果4翻译结果5 翻译结果1复制译文编辑译文朗读译文返回顶部 包顶部 翻译结果2复制译文编辑译文朗读译文返回顶部...
DRC的时候 Package到package距离 就是两个Place_bound之间的距离，另外限制高度的时候要用到的。) G; ...
A fill-through-the-top reclosable package includes first and second opposing body panels joined to each other along a pair of sides and a bottom bridging the pair of sides. The package is provided with a reclosable fastener extending along a package top disposed opposite the bottom. The fastene...
golang 导入 sdk报 package topsdk is not in GOROOT echo_return 23534673 发布于 2022-04-07 更新于 2022-04-07 对接外部 sdk,在 utils文件夹下的代码中引入 topsdk,引入后运行项目报如题错误,请教可以如何解决? go 有用关注2收藏 回复 阅读1.5k Vanmu: go mod 里有个 replace指令可以试下 回复...
In recent years, Package on Package (PoP), in which a top memory packaging system is connected to a bottom logic package via solder joint, is a System-in-Package (SiP) solution adopted by more and more component manufacturers. To guarantee the yield and reliability of the solder joint betwe...
An improved package is thinner with increased memory capacity and improved heat emission effect. The package includes a plurality of leads, where each lead comprises a first connection lead and a second connection lead with upper and lower surfaces. An integrated chip, such as a semiconductor chip...
ent.sina.com.cn|基于2个网页 3. 顶级包 (2) 将顶级包(top package)重命名为Company Enterprise System。要重命 名Model Explorer 中的一个元素,选定该包并按下F2… www.docin.com|基于 1 个网页 例句
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